EPM7256SQC208-10N

Introducing the EPM7256SQC208-10N, a highly advanced programmable logic device designed to offer unmatched performance and versatility for today's demanding electronic applications. Built with cutting-edge technology, this product delivers superior functionality and efficiency, making it the ideal choice for a wide range of industries, including telecommunications, automotive, and aerospace. The EPM7256SQC208-10N features a robust architecture with 256 macrocells, allowing for complex and intricate designs to be implemented with ease. Its high density and low power consumption make it an excellent solution for space-constrained applications without compromising performance. Equipped with 10ns propagation delay, this programmable logic device ensures lightning-fast data processing and response times, enabling seamless integration into any system. Additionally, the EPM7256SQC208-10N offers extensive programming options and compatibility with a variety of design tools, facilitating easier customization and reducing time-to-market. With its exceptional performance, versatility, and reliability, the EPM7256SQC208-10N is the ultimate solution for designers, enabling them to create innovative and future-proof electronic systems. Trust us to deliver the quality and performance your projects demand.

banner

Other Products

View More
  • Fairchild Semiconductor FM24C16UFEM8

    Fairchild Semiconductor FM24C16UFEM8

  • Winbond Electronics W25Q512JVFIM

    Winbond Electronics W25Q512JVFIM

  • Rohm Semiconductor BR93L56RFVM-WTR

    Rohm Semiconductor BR93L56RFVM-WTR

  • Renesas Electronics America Inc IDT71V416YS15YI

    Renesas Electronics America Inc IDT71V416YS15YI

  • ISSI, Integrated Silicon Solution Inc IS61DDPB24M18A-400M3L

    ISSI, Integrated Silicon Solution Inc IS61DDPB24M18A-400M3L

  • Infineon Technologies S25FL116K0XMFIS11

    Infineon Technologies S25FL116K0XMFIS11

  • Renesas Electronics America Inc R1LV0108ESA-5SI#B0

    Renesas Electronics America Inc R1LV0108ESA-5SI#B0

  • ProLabs A2338117-C

    ProLabs A2338117-C

  • Alliance Memory, Inc. AS4C64M16D2A-25BIN

    Alliance Memory, Inc. AS4C64M16D2A-25BIN

  • Renesas Electronics America Inc 7007L35GB

    Renesas Electronics America Inc 7007L35GB

  • Micron Technology Inc. MT42L128M32D1GU-18 WT:A TR

    Micron Technology Inc. MT42L128M32D1GU-18 WT:A TR

  • Micron Technology Inc. MT42L256M64D4LD-18 WT:A TR

    Micron Technology Inc. MT42L256M64D4LD-18 WT:A TR

Related Blogs

  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
Contact Information
close