In recent years, the rapid development of artificial intelligence (AI) technology has significantly driven the growth in energy demand for global data centers. Especially, generative AI models like ChatGPT require immense computing power, leading to a sharp increase in data center electricity consum...
Memory, as a core component of computer systems, bears the crucial tasks of data storage and rapid retrieval. Since its debut in 2000, DDR memory (Double Data Rate memory) technology has become mainstream due to its advantage of double data transfer rates. DDR memory technology has continually evolv...
In recent years, the FPGA (Field-Programmable Gate Array) industry has been undergoing an unprecedented transformation, with the current state of FPGAs appearing increasingly complex. Due to the turbulence of key players within the industry, the market situation for FPGAs has become unclear. However...
Microsoft has recently announced plans to invest nearly $10 billion between 2023 and 2030 to rent servers from the artificial intelligence (AI) startup CoreWeave, to support the operation of its AI models. This substantial investment not only demonstrates Microsoft's firm commitment to the AI fi...
What is FPGA?FPGA (Field-Programmable Gate Array) is an integrated circuit that can be programmed by the user in the field. In simple terms, FPGA is a type of embedded integrated circuit that can be reconfigured through software, allowing developers to design and implement digital circuits as needed...
In the rapidly evolving field of wireless communications, Radio Frequency Integrated Circuits (RFICs) play a pivotal role. Serving as the bridge between the digital and physical worlds, RF chips are not only responsible for transmitting and receiving information but also serve as the core driving fo...
In the global semiconductor industry, Taiwan Semiconductor Manufacturing Company (TSMC) holds a pivotal position with its cutting-edge process technologies and advanced packaging techniques. Recently, TSMC announced plans to adjust the prices of its 3nm process and CoWoS packaging technology in 2025...
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