GAL16V8D-25QJI

Introducing the GAL16V8D-25QJI, a versatile and high-performance programmable logic device designed to meet the needs of today's complex digital systems. Whether you are developing consumer electronics, industrial automation, or telecommunications equipment, this device offers a comprehensive solution for advanced logic functions. With its advanced architecture and generous capacity of up to 64 inputs and 8 outputs, the GAL16V8D-25QJI allows you to implement complex digital designs efficiently. Its high-speed operation ensures optimal performance, enabling you to achieve your design goals with ease. One of the standout features of this product is its in-system programmability, which allows for convenient and flexible design changes without requiring extensive hardware modifications or re-designs. This saves valuable time and resources, making it an invaluable tool for design iterations or last-minute adjustments. Furthermore, the GAL16V8D-25QJI is designed to be highly reliable, with low static power consumption and robust ESD protection, ensuring a long lifespan and dependable performance. It is also available in a compact and durable package, making it suitable for a wide range of applications without compromising on space or durability. In summary, the GAL16V8D-25QJI is a versatile and high-performance programmable logic device that is a must-have for any digital system designer. Its advanced features, in-system programmability, and reliable performance make it the perfect choice for both small-scale and complex projects.

banner

Other Products

View More
  • Microchip Technology SST26VF064BAT-104I/SM

    Microchip Technology SST26VF064BAT-104I/SM

  • Renesas Electronics America Inc 70V07L55J8

    Renesas Electronics America Inc 70V07L55J8

  • STMicroelectronics M24M01-HRMN6P

    STMicroelectronics M24M01-HRMN6P

  • Micron Technology Inc. MT46V32M8BG-5B:GTR

    Micron Technology Inc. MT46V32M8BG-5B:GTR

  • Micron Technology Inc. MT29F512G08CUCABH3-12IT:A TR

    Micron Technology Inc. MT29F512G08CUCABH3-12IT:A TR

  • Microchip Technology AT28BV64-30TC

    Microchip Technology AT28BV64-30TC

  • ProLabs 852261-001-C

    ProLabs 852261-001-C

  • Spansion S25FS256SAGNFI001

    Spansion S25FS256SAGNFI001

  • Cypress Semiconductor Corp S26KL256SDABHB030A

    Cypress Semiconductor Corp S26KL256SDABHB030A

  • Micron Technology Inc. MT25QL512ABA8E12-0SIT TR

    Micron Technology Inc. MT25QL512ABA8E12-0SIT TR

  • Intel QG82945P

    Intel QG82945P

  • IDT, Integrated Device Technology Inc 71256SA15TPGI

    IDT, Integrated Device Technology Inc 71256SA15TPGI

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close