IDT7132SA25J

Introducing the IDT7132SA25J, a high-performance and versatile programmable read-only memory (PROM) designed to meet the demanding requirements of various applications. With its industry-leading operating frequency of 25MHz, the IDT7132SA25J delivers lightning-fast access times, ensuring efficient and quick data retrieval. Its large storage capacity of 32K x 8 bits accommodates ample data, making it ideal for storage-intensive tasks. The device features a robust architecture that enables easy customization of memory contents using a simple programming process. This flexibility makes the IDT7132SA25J suitable for a wide range of applications, including embedded systems, telecommunications equipment, automotive electronics, and more. Moreover, the PROM is built with durable and reliable components, ensuring long-lasting performance in challenging environments. It operates on a low power supply, enabling energy efficiency without compromising on functionality. With its exceptional speed, extensive memory, and adaptability, the IDT7132SA25J is the perfect solution for engineers and designers looking to enhance system performance and optimize memory management.

banner

Other Products

View More
  • 118-3314J-1-501GTR-ND,118-3314J-1-501GCT-ND,118-3314J-1-501GDKR-ND

    118-3314J-1-501GTR-ND,118-3314J-1-501GCT-ND,118-3314J-1-501GDKR-ND

  • 78LBWR2KLF-ND

    78LBWR2KLF-ND

  • 716-P11S1VAFRSY00222MA-ND

    716-P11S1VAFRSY00222MA-ND

  • PV32P202A02B00-ND

    PV32P202A02B00-ND

  • 716-P11S1G0BJSY00103JA-ND

    716-P11S1G0BJSY00103JA-ND

  • 3296P-502LF-ND

    3296P-502LF-ND

  • 3006P-501LF-ND

    3006P-501LF-ND

  • EVM-AASA00BY2-ND

    EVM-AASA00BY2-ND

  • 3329X-104LF-ND

    3329X-104LF-ND

  • Y00511K00000J0L-ND

    Y00511K00000J0L-ND

  • 78LBWR100KLF-ND

    78LBWR100KLF-ND

  • 716-TS6Y203KR10TR-ND

    716-TS6Y203KR10TR-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close