IR2106STRPBF

The IR2106STRPBF is a high voltage, high-speed power MOSFET and IGBT driver. It is designed to control both the high-side and low-side switch of a half-bridge configuration. This driver IC is ideal for applications such as motor drive circuits, switch mode power supplies, and uninterruptible power supplies. Featuring a floating channel, the IR2106STRPBF provides optimum flexibility to drive both lower and upper MOSFETs or IGBTs. This allows for easy implementation of a high-frequency PWM circuit. With its low delay time and low propagation delay variation, this driver IC ensures precise control and efficient switching performance. It also offers various protection features such as under-voltage lockout, short circuit protection, and thermal shutdown. The IR2106STRPBF is offered in an 8-pin SOIC package, making it compact and easy to use in a wide range of applications. It has a wide supply voltage range of 10V to 20V, allowing for compatibility with various power supply units. With its high reliability, exceptional performance, and comprehensive protection features, the IR2106STRPBF is the perfect choice for demanding power control applications.

banner

Other Products

View More
  • 3465-WW-EWS3-3-ND

    3465-WW-EWS3-3-ND

  • LZP-D0UA00-00U5-ND

    LZP-D0UA00-00U5-ND

  • 1125-1505-ND

    1125-1505-ND

  • 475-SFH4235-ZTR-ND,475-SFH4235-ZCT-ND,475-SFH4235-ZDKR-ND

    475-SFH4235-ZTR-ND,475-SFH4235-ZCT-ND,475-SFH4235-ZDKR-ND

  • 365-1588-ND

    365-1588-ND

  • OP291B-ND

    OP291B-ND

  • 365-1147-2-ND,365-1147-1-ND,365-1147-6-ND

    365-1147-2-ND,365-1147-1-ND,365-1147-6-ND

  • 2460-L933-SP275-2-30TR-ND

    2460-L933-SP275-2-30TR-ND

  • ASDL-4263-C22-ND

    ASDL-4263-C22-ND

  • LTE-3279K-ND

    LTE-3279K-ND

  • 1830-INL-5AIR45-ND

    1830-INL-5AIR45-ND

  • 751-1217-2-ND,751-1217-1-ND,751-1217-6-ND

    751-1217-2-ND,751-1217-1-ND,751-1217-6-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close