IR2111STRPBF

The IR2111STRPBF is a high voltage, high speed power MOSFET and IGBT driver integrated circuit (IC). This compact and versatile IC is specifically designed to provide a robust and efficient solution for driving MOSFETs and IGBTs in a wide range of applications such as motor drives, power supplies, and inverters. With its built-in bootstrap diode, the IR2111STRPBF enables efficient high side driving of N-channel MOSFETs, eliminating the need for an additional external diode. It features an input logic level gate drive which allows direct interface with low voltage microcontrollers or DSPs, ensuring easy integration into any control system. The compact 14-pin SOIC package of the IR2111STRPBF offers excellent thermal performance, making it suitable for applications demanding high power density. The IC also incorporates overcurrent protection and under-voltage lockout features, providing enhanced reliability and protection to the driven devices. With its high voltage capability (up to 600V) and fast switching times, the IR2111STRPBF offers a reliable and efficient solution for driving power MOSFETs and IGBTs, making it an ideal choice for a wide range of industrial and automotive applications.

banner

Other Products

View More
  • STMicroelectronics M4T32-BR12SH1

    STMicroelectronics M4T32-BR12SH1

  • STMicroelectronics M4T28-BR12SH1

    STMicroelectronics M4T28-BR12SH1

  • Texas Instruments BQ48SH-28X6NSH

    Texas Instruments BQ48SH-28X6NSH

  • STMicroelectronics M4T32-BR12SH6

    STMicroelectronics M4T32-BR12SH6

Related Blogs

  • 2026 / 03 / 31

    Omron Divests Core Electronic Components Business

    Omron divests its founding Device & Module Solutions business to Carlyle for ¥81 billion. The electronic components unit will become independent via a two-phase transaction in 2026, allowing OMRON to focus on industrial automation....

    Omron Divests Core Electronic Components Business
  • 2026 / 03 / 30

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market

    Apple partners with YMTC to integrate China-made NAND flash into China-exclusive iPhones, cutting costs amid rising memory prices. ...

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market
  • 2026 / 03 / 27

    Micron Considers Acquisition of JDI's Mobara Plant

    Micron is in talks to acquire JDI's Mobara LCD plant in Japan for conversion into a semiconductor assembly and testing facility....

    Micron Considers Acquisition of JDI's Mobara Plant
  • 2026 / 03 / 26

    Tower Semiconductor Strategically Restructures Japan Operations

    Tower Semiconductor restructures Japan operations: acquires full ownership of 300mm Fab 7 while Nuvoton takes 200mm Fab 5 for $25M...

    Tower Semiconductor Strategically Restructures Japan Operations
  • 2026 / 03 / 25

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide

    A comprehensive guide to AMD/Xilinx FPGA evolution, spanning from classic CPLDs and early XC3000/4000 architectures through cost-optimized Spartan series to cutting-edge Zynq UltraScale+ MPSoCs......

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
  • 2026 / 03 / 24

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers

    The FCC has banned all foreign-manufactured consumer routers from entering the U.S. market without authorization, citing national security risks....

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
  • 2026 / 03 / 23

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products

    Discover Qorvo's industry-leading RF solutions and GaN power amplifiers. From 5G infrastructure to satellite communications, explore best-selling ICs including QPA2966, TGA2214-CP, and QPA1314......

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
  • 2026 / 03 / 20

    Three core components of power electronics: MOSFET, BJT, and IGBT

    A concise comparison of MOSFET, BJT, and IGBT— fundamental power semiconductor devices spanning voltage-controlled high-speed switching, current-controlled amplification, and hybrid high-voltage power solutions...

    Three core components of power electronics: MOSFET, BJT, and IGBT
  • 2026 / 03 / 19

    Middle East Conflict Triggers Risk of Surging Chip Material Costs

    Middle East conflict disrupts Qatar's helium supply, threatening semiconductor manufacturing costs. Chipmakers rely on helium for lithography, cooling, and leak detection—with no viable substitutes....

    Middle East Conflict Triggers Risk of Surging Chip Material Costs
  • 2026 / 03 / 18

    Break the Ice! NVIDIA Resumes H200 Production for China

    Nvidia resumes H200 chip production for China after securing U.S. export licenses. The restart follows December 2025 policy changes allowing sales with 25% revenue-sharing requirements....

    Break the Ice! NVIDIA Resumes H200 Production for China
Contact Information
close