IR2153STRPBF

Introducing the IR2153STRPBF, a highly efficient and flexible control IC designed for half-bridge and full-bridge resonant converter applications. This intelligent product from Infineon Technologies is specifically developed for use in motor drives, uninterruptible power supplies (UPS), and switch mode power supplies (SMPS), catering to a wide range of industries. The IR2153STRPBF offers comprehensive protection features such as over-current shutdown, under-voltage lockout, and thermal shutdown, ensuring the safety and reliability of your systems. It also boasts a high-voltage gate drive with internal miller clamp, allowing for precise control of half-bridge topologies. Designed with compatibility in mind, the IR2153STRPBF is pin-compatible with the existing industry-standard, offering easy integration into your current designs. With a wide input voltage range and excellent noise immunity, this IC delivers stable and high-performance functionality even in demanding operating conditions. Backed by Infineon Technologies' years of experience and expertise in the semiconductor industry, the IR2153STRPBF guarantees top-level quality and durability. Experience superior performance and efficiency with the IR2153STRPBF control IC for your next electronics project.

banner

Other Products

View More
  • Monolithic Power Systems Inc. MP18024HN-LF

    Monolithic Power Systems Inc. MP18024HN-LF

  • Infineon Technologies IR21141SSTRPBF

    Infineon Technologies IR21141SSTRPBF

  • Analog Devices Inc./Maxim Integrated MAX628ESA

    Analog Devices Inc./Maxim Integrated MAX628ESA

  • Microchip Technology MIC4604YMT-TR

    Microchip Technology MIC4604YMT-TR

  • Infineon Technologies IR2302PBF

    Infineon Technologies IR2302PBF

  • Microchip Technology MCP14E6-E/SN

    Microchip Technology MCP14E6-E/SN

  • Infineon Technologies IR21271STR

    Infineon Technologies IR21271STR

  • Infineon Technologies CHL8505CRT

    Infineon Technologies CHL8505CRT

  • Texas Instruments UCC27528DSDT

    Texas Instruments UCC27528DSDT

  • STMicroelectronics L6393DTR

    STMicroelectronics L6393DTR

  • Renesas Electronics America Inc ISL6614CRZR5238

    Renesas Electronics America Inc ISL6614CRZR5238

  • Microchip Technology TC4467EOE

    Microchip Technology TC4467EOE

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close