IXTA88N085T

Introducing the IXTA88N085T, a versatile and highly efficient power module designed to meet the demanding requirements of various applications. With a compact and robust design, this power module offers an exceptional level of performance, making it ideal for use in industrial, automotive, and consumer electronic devices. Equipped with advanced power management features, the IXTA88N085T provides smooth and reliable power delivery, ensuring optimal performance and efficiency. Its high voltage and current capabilities make it suitable for a wide range of applications, including motor drives, LED lighting, and power supplies. The IXTA88N085T is built using the latest semiconductor technology, allowing for excellent thermal performance and reliability. Its integrated protection features, such as overcurrent and overtemperature protection, safeguard against any unforeseen events, providing long-term durability. Furthermore, this power module is easy to use, with a simple and intuitive design for quick integration into existing systems. Its compact size allows for flexible installation in space-constrained environments. In summary, the IXTA88N085T is a reliable, efficient, and user-friendly power module that caters to a wide range of applications. Experience the power of innovation with the IXTA88N085T today.

banner

Other Products

View More
  • VTC03E048TRSM-ND

    VTC03E048TRSM-ND

  • 9405R-08-ND

    9405R-08-ND

  • 9406-40-ND

    9406-40-ND

  • 9406R-50-ND

    9406R-50-ND

  • 308-2339-ND

    308-2339-ND

  • WVL9EB8R2K-ND

    WVL9EB8R2K-ND

  • 9406R-54-ND

    9406R-54-ND

  • 9405-24-ND

    9405-24-ND

  • 9405R-02-ND

    9405R-02-ND

  • WVL9FJ123K-ND

    WVL9FJ123K-ND

  • WVL9FJ270K-ND

    WVL9FJ270K-ND

  • 9406-14-ND

    9406-14-ND

Related Blogs

  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
Contact Information
close