LC4064V-75TN48C

Introducing the LC4064V-75TN48C, a high-performance programmable logic device designed to meet the demands of today's complex electronic systems. With its advanced features and versatile functionality, this FPGA (Field-Programmable Gate Array) is the ideal solution for a wide range of applications including industrial automation, telecommunications, and consumer electronics. The LC4064V-75TN48C offers a generous capacity of 64 logic cells, allowing for the implementation of intricate logic functions and algorithms. Its fast propagation delay and high-speed performance ensure swift and efficient data processing, enabling seamless operation in real-time applications. This FPGA incorporates a high-speed, low-power architecture, making it suitable for power-sensitive devices and battery-operated applications. Its exceptional power efficiency minimizes energy consumption, prolonging battery life and reducing operating costs. The LC4064V-75TN48C features a user-friendly design with an industry-standard hardware description language, facilitating easy programming and configuration. Its reliable and robust structure guarantees long-lasting performance and durability, even in demanding industrial environments. In conclusion, the LC4064V-75TN48C FPGA offers a powerful and flexible solution for developers and engineers seeking top-of-the-line programmable logic devices. Its exceptional performance, energy-efficiency, and ease of use make it the perfect choice for a wide range of applications.

banner

Other Products

View More
  • Analog Devices Inc. AD652SQ/883B

    Analog Devices Inc. AD652SQ/883B

  • Texas Instruments VFC110AP-2

    Texas Instruments VFC110AP-2

  • Analog Devices Inc. AD7741BN

    Analog Devices Inc. AD7741BN

  • Burr Brown VFC320CP

    Burr Brown VFC320CP

  • Analog Devices Inc. AD7741BRZ

    Analog Devices Inc. AD7741BRZ

  • Analog Devices Inc. AD7750AN

    Analog Devices Inc. AD7750AN

  • Analog Devices Inc. AD652AQ/+

    Analog Devices Inc. AD652AQ/+

  • Texas Instruments VFC32KUG4

    Texas Instruments VFC32KUG4

  • Analog Devices Inc. AD654JRZ-REEL

    Analog Devices Inc. AD654JRZ-REEL

  • Analog Devices Inc. AD7740KRM-REEL7

    Analog Devices Inc. AD7740KRM-REEL7

  • Texas Instruments LM2917M-8/NOPB

    Texas Instruments LM2917M-8/NOPB

  • National Semiconductor LM231N

    National Semiconductor LM231N

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close