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2026 / 04 / 03
Twin Troubles: Nokia and Ericsson Announce Global Layoffs
Nokia and Ericsson Global Layoffs. Nokia plans 4,100 layoffs to save €1.2B. Ericsson will continue 2025's 5,000-job reduction pace, including 1,600 cuts in Sweden. ...
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2026 / 04 / 02
Kioxia to Discontinue Entire Traditional MLC/2D NAND Portfolio
Kioxia will gradually discontinue traditional MLC/2D NAND products. This includes 32–15nm floating-gate 2D NAND, early BiCS 3D NAND, and all cell types across multiple form factors....
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2026 / 03 / 31
Omron Divests Core Electronic Components Business
Omron divests its founding Device & Module Solutions business to Carlyle for ¥81 billion. The electronic components unit will become independent via a two-phase transaction in 2026, allowing OMRON to focus on industrial automation....
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2026 / 03 / 30
Apple to Integrate YMTC NAND Flash, Exclusively for China Market
Apple partners with YMTC to integrate China-made NAND flash into China-exclusive iPhones, cutting costs amid rising memory prices. ...
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2026 / 03 / 27
Micron Considers Acquisition of JDI's Mobara Plant
Micron is in talks to acquire JDI's Mobara LCD plant in Japan for conversion into a semiconductor assembly and testing facility....
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2026 / 03 / 26
Tower Semiconductor Strategically Restructures Japan Operations
Tower Semiconductor restructures Japan operations: acquires full ownership of 300mm Fab 7 while Nuvoton takes 200mm Fab 5 for $25M...
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2026 / 03 / 25
Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
A comprehensive guide to AMD/Xilinx FPGA evolution, spanning from classic CPLDs and early XC3000/4000 architectures through cost-optimized Spartan series to cutting-edge Zynq UltraScale+ MPSoCs......
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2026 / 03 / 24
FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
The FCC has banned all foreign-manufactured consumer routers from entering the U.S. market without authorization, citing national security risks....
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2026 / 03 / 23
Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
Discover Qorvo's industry-leading RF solutions and GaN power amplifiers. From 5G infrastructure to satellite communications, explore best-selling ICs including QPA2966, TGA2214-CP, and QPA1314......
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2026 / 03 / 20
Three core components of power electronics: MOSFET, BJT, and IGBT
A concise comparison of MOSFET, BJT, and IGBT— fundamental power semiconductor devices spanning voltage-controlled high-speed switching, current-controlled amplification, and hybrid high-voltage power solutions...