LFE5U-25F-6BG381C

Introducing the LFE5U-25F-6BG381C Programmable Logic Device, our latest innovation designed to enhance your digital design solutions. This advanced device is engineered to provide exceptional performance and versatility for a broad range of applications. Equipped with advanced features, the LFE5U-25F-6BG381C offers a superior logic density of 25,700 Look-Up Tables (LUTs), allowing for complex digital circuits to be implemented with ease. The device also includes 6 high-speed SERDES channels, providing up to 3.75 Gbps of data transfer for efficient connectivity. With a compact form factor and low power consumption, the LFE5U-25F-6BG381C is ideal for use in various industries such as automotive, industrial automation, and communication systems. It also includes robust security features, ensuring the protection of your intellectual property. Featuring the innovative SmartCompress technology, this device offers enhanced storage capacity, enabling efficient utilization of resources and reducing power consumption. The LFE5U-25F-6BG381C is the perfect solution for design engineers looking to implement advanced digital designs with outstanding performance and reliability. Experience the power of cutting-edge programmable logic devices with the LFE5U-25F-6BG381C.

banner

Other Products

View More
  • 350-1235-ND

    350-1235-ND

  • L20087-ND

    L20087-ND

  • FLPR3.0-SG-ND

    FLPR3.0-SG-ND

  • 593232323302F-ND

    593232323302F-ND

  • 5526033200F-ND

    5526033200F-ND

  • 67-1313-ND

    67-1313-ND

  • 350-4099-2-ND,350-4099-1-ND,350-4099-6-ND

    350-4099-2-ND,350-4099-1-ND,350-4099-6-ND

  • 2266-553-0710-100F-ND

    2266-553-0710-100F-ND

  • 2266-553-0002-819F-ND

    2266-553-0002-819F-ND

  • PCL200C-BR12V-ND

    PCL200C-BR12V-ND

  • 5530103F-ND

    5530103F-ND

  • 5610901070F-ND

    5610901070F-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close