LFXP2-8E-5TN144C

Introducing the groundbreaking LFXP2-8E-5TN144C, a revolutionary product designed to transform the world of electronic devices. This cutting-edge field-programmable gate array (FPGA) offers unmatched performance and versatility, making it a game-changer in various industries. With its advanced architecture and high-speed capabilities, the LFXP2-8E-5TN144C provides seamless integration and exceptional agility for complex designs. Its embedded memory and flexible IO make it ideal for a wide range of applications, from telecommunications and automotive to industrial automation and aerospace. This FPGA offers generous logic density and unique features like non-volatile configuration and low power consumption. The LFXP2-8E-5TN144C's 8,000 logic cells provide immense scalability, allowing users to adapt and customize their designs to meet specific requirements effortlessly. Furthermore, this product is accompanied by a comprehensive suite of software tools that simplify the development process, enabling rapid prototyping and seamless debugging. With the LFXP2-8E-5TN144C, you can bring your innovative ideas to life and stay at the forefront of technological advancements. Embrace the future of electronics with the LFXP2-8E-5TN144C FPGA and unlock the true potential of your designs.

banner

Other Products

View More
  • Microchip Technology CAP1208-1-SL-TR

    Microchip Technology CAP1208-1-SL-TR

  • Microchip Technology QT1103-ISG

    Microchip Technology QT1103-ISG

  • Microchip Technology QT1080-IS48G

    Microchip Technology QT1080-IS48G

  • NXP USA Inc. PCF8885TS/1,118

    NXP USA Inc. PCF8885TS/1,118

  • Infineon Technologies CY8CMBR2016-24LQXI

    Infineon Technologies CY8CMBR2016-24LQXI

  • Microchip Technology CAP1188-1-CP-TR

    Microchip Technology CAP1188-1-CP-TR

  • Microchip Technology QT160-D

    Microchip Technology QT160-D

  • Microchip Technology QT113-IS

    Microchip Technology QT113-IS

  • Microchip Technology QT1081-ISG

    Microchip Technology QT1081-ISG

  • Microchip Technology QT1101-IS48G

    Microchip Technology QT1101-IS48G

  • Azoteq (Pty) Ltd IQS680-100-DNR

    Azoteq (Pty) Ltd IQS680-100-DNR

  • Silicon Labs CPT112S-A02-GUR

    Silicon Labs CPT112S-A02-GUR

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close