MASW-007072-0001TR

Introducing the MASW-007072-0001TR, a high-performance GaAs SPDT switch designed for a wide range of applications. This innovative product offers excellent RF performance, making it ideal for use in wireless communication systems, radar systems, and aerospace applications. With a frequency range of 0.1 to 40 GHz, the MASW-007072-0001TR provides reliable and efficient switching with low insertion loss and high isolation. This allows for seamless integration into complex RF designs, ensuring optimal signal quality and reduced interference. The compact SOT-363 package offers high power handling capability and electrostatic discharge (ESD) protection, making it a reliable solution for demanding environments. Furthermore, the MASW-007072-0001TR features fast switching speed, enabling quick and precise signal routing. Designed with the latest advancements in GaAs technology, this SPDT switch delivers exceptional performance, reliability, and durability. Whether you're looking to enhance the performance of wireless communication systems or improve radar and aerospace applications, the MASW-007072-0001TR is the perfect choice.

banner

Other Products

View More
  • Analog Devices Inc. AD7755AN

    Analog Devices Inc. AD7755AN

  • STMicroelectronics STPM10BTR

    STMicroelectronics STPM10BTR

  • Analog Devices Inc. ADE7761BARS

    Analog Devices Inc. ADE7761BARS

  • Analog Devices Inc. AD71167ARWZ

    Analog Devices Inc. AD71167ARWZ

  • Analog Devices Inc. ADE7759ARSZRL

    Analog Devices Inc. ADE7759ARSZRL

  • Microchip Technology 90E32AERGI

    Microchip Technology 90E32AERGI

  • Analog Devices Inc./Maxim Integrated 71M6511-IGTR/F

    Analog Devices Inc./Maxim Integrated 71M6511-IGTR/F

  • Microchip Technology MCP3913A1-E/MV

    Microchip Technology MCP3913A1-E/MV

  • STMicroelectronics STPM33TR

    STMicroelectronics STPM33TR

  • Microchip Technology MCP3905-I/SS

    Microchip Technology MCP3905-I/SS

  • Analog Devices Inc. ADE7116ASTZF16-RL

    Analog Devices Inc. ADE7116ASTZF16-RL

  • Analog Devices Inc./Maxim Integrated 71M6543GT-IGTR/F

    Analog Devices Inc./Maxim Integrated 71M6543GT-IGTR/F

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close