MPC8360CVVAJDGA

Introducing the MPC8360CVVAJDGA, a powerful and efficient microprocessor designed to meet the growing demands of today's advanced applications. This high-performance product is specifically engineered for networking, industrial control, and embedded computing systems. The MPC8360CVVAJDGA boasts a 1.0 GHz PowerPC e600 core, providing robust processing capabilities to handle complex tasks with ease. It also features an integrated security engine, enabling secure data transfer and protection against cyber threats. With its advanced features and multiple connectivity options, the MPC8360CVVAJDGA offers exceptional flexibility for a wide range of applications. It supports up to six gigabit Ethernet ports, USB interfaces, and various memory options, ensuring seamless integration into existing systems. In addition to its performance, the MPC8360CVVAJDGA is designed to operate efficiently, minimizing power consumption without compromising on performance. This makes it an ideal choice for applications requiring high performance while adhering to strict energy-efficient standards. Overall, the MPC8360CVVAJDGA is a cutting-edge microprocessor that delivers exceptional performance and versatility, making it the perfect solution for demanding networking, industrial control, and embedded computing applications.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated DS2484Q+U

    Analog Devices Inc./Maxim Integrated DS2484Q+U

  • Analog Devices Inc. IA82510PLC28IR2

    Analog Devices Inc. IA82510PLC28IR2

  • Microchip Technology MIC2012-1PCQS-TR

    Microchip Technology MIC2012-1PCQS-TR

  • Microchip Technology ENC28J60/ML

    Microchip Technology ENC28J60/ML

  • Microchip Technology KSZ9893RNXI-TR

    Microchip Technology KSZ9893RNXI-TR

  • Microchip Technology COM20020ILJP

    Microchip Technology COM20020ILJP

  • Broadcom Limited BCM5720-2PBLK

    Broadcom Limited BCM5720-2PBLK

  • FTDI, Future Technology Devices International Ltd VNC1L-1A-TRAY

    FTDI, Future Technology Devices International Ltd VNC1L-1A-TRAY

  • Microchip Technology USB5816T/KD

    Microchip Technology USB5816T/KD

  • Broadcom Limited BCM68571SD01

    Broadcom Limited BCM68571SD01

  • Renesas Design Germany GmbH IW657P-30-72

    Renesas Design Germany GmbH IW657P-30-72

  • NXP USA Inc. PCA9665BS118

    NXP USA Inc. PCA9665BS118

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close