MTB09N06I3

Introducing the MTB09N06I3, a highly reliable and efficient power MOSFET designed for a wide range of applications. This product offers exceptional performance while reducing power consumption, making it an ideal choice for various electronic devices. With a voltage rating of 60 volts and a current rating of 9 amperes, the MTB09N06I3 ensures optimal power handling capability, allowing for seamless operation in demanding conditions. Its low on-resistance minimizes power losses and heat dissipation, increasing overall system efficiency. The MTB09N06I3 is equipped with advanced features, including a built-in protection diode, ensuring safe and efficient operation. This MOSFET also boasts a fast switching speed, enabling high-performance switching applications. In addition to its excellent electrical characteristics, the MTB09N06I3 has a compact and robust design, guaranteeing high reliability and durability. Its industry-standard TO-220AB package provides easy assembly and compatibility with existing systems. Whether you are designing power supplies, motor control circuits, or other applications, the MTB09N06I3 is a superior choice for achieving optimal performance and efficiency. Trust the reliability and performance of the MTB09N06I3 for all your power MOSFET needs.

banner

Other Products

View More
  • Rohm Semiconductor BA5946FP-E2

    Rohm Semiconductor BA5946FP-E2

  • Nuvoton Technology Corporation NCT3942S-A TR

    Nuvoton Technology Corporation NCT3942S-A TR

  • onsemi AMIS30523C5231RG

    onsemi AMIS30523C5231RG

  • Diodes Incorporated ZXBM2002X10TC

    Diodes Incorporated ZXBM2002X10TC

  • Diodes Incorporated AH9280Z4-G1

    Diodes Incorporated AH9280Z4-G1

  • Toshiba Semiconductor and Storage TB6549HQ(O)

    Toshiba Semiconductor and Storage TB6549HQ(O)

  • Sanken SLA6870MZ

    Sanken SLA6870MZ

  • Texas Instruments DRV8833CPWPR

    Texas Instruments DRV8833CPWPR

  • STMicroelectronics L6235D

    STMicroelectronics L6235D

  • onsemi LB11683H-MPB-E

    onsemi LB11683H-MPB-E

  • onsemi LC898119XC-MH

    onsemi LC898119XC-MH

  • Microchip Technology MTD6502B-HC1-00

    Microchip Technology MTD6502B-HC1-00

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close