P6KE13(C)

Introducing the P6KE13(C), an advanced surge protection diode that guarantees the safety and longevity of your electronic devices. Designed to handle high voltage surges, this product is a must-have for anyone seeking reliable protection. The P6KE13(C) is meticulously engineered to provide optimal performance and safeguard against power fluctuations. With a peak pulse power dissipation of 600 watts, it effectively absorbs transient voltage spikes, preventing any potential damage to your valuable equipment. Its low clamping voltage ensures quick response times, minimizing the risk of sustained overvoltages. Additionally, the P6KE13(C) boasts high surge capability and low leakage currents, making it suitable for a wide range of applications, including power supplies, consumer electronics, telecommunications, and industrial equipment. Backed by rigorous testing and compliance with international standards, the P6KE13(C) offers unrivaled reliability and durability. Its compact design allows for easy integration into various circuit boards, ensuring hassle-free installation. Protect your investments with the P6KE13(C) surge protection diode – the ultimate solution for robust surge protection.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated MAX13102EETL+T

    Analog Devices Inc./Maxim Integrated MAX13102EETL+T

  • Microchip Technology SY100ELT22LZI

    Microchip Technology SY100ELT22LZI

  • Fairchild Semiconductor MC10H351FNR2G

    Fairchild Semiconductor MC10H351FNR2G

  • Nexperia USA Inc. 74LVC2T45GT,115

    Nexperia USA Inc. 74LVC2T45GT,115

  • Texas Instruments 74AVC1T45DCKR

    Texas Instruments 74AVC1T45DCKR

  • Texas Instruments TXB0102DCURG4

    Texas Instruments TXB0102DCURG4

  • onsemi NLSV4T244MUTAG

    onsemi NLSV4T244MUTAG

  • Microchip Technology SY100EL90VZG-TR

    Microchip Technology SY100EL90VZG-TR

  • NXP Semiconductors 74LVCH1T45GM,115

    NXP Semiconductors 74LVCH1T45GM,115

  • NXP Semiconductors 74LVC4245ADB,112

    NXP Semiconductors 74LVC4245ADB,112

  • Texas Instruments SN74LVC1T45DRLRG4

    Texas Instruments SN74LVC1T45DRLRG4

  • NXP USA Inc. NTS0102GT,115

    NXP USA Inc. NTS0102GT,115

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close