P6KE300(C)A

Introducing the P6KE300(C)A, a high-performance transient voltage suppressor diode designed to protect sensitive electronic devices from voltage spikes and transient surges. Crafted with precision and utilizing cutting-edge technology, the P6KE300(C)A offers unparalleled protection for a wide range of applications, including telecommunications, industrial equipment, power supplies, and consumer electronics. This diode has a peak pulse power dissipation of 600 watts, providing robust protection against high-energy transients and voltage surges. Its low-profile DO-15 package allows for easy integration into existing circuitry, while its fast response time ensures rapid clamp performance to limit voltage fluctuations and safeguard valuable components. The P6KE300(C)A is designed with reverse standoff voltage of 256V and a maximum clamping voltage of 413V, making it an ideal choice for applications requiring higher voltage tolerance. Whether you need to protect sensitive electronic components from lightning strikes or other voltage surges, the P6KE300(C)A delivers reliable, cost-effective solutions for your transient voltage suppression needs. Trust in its superior performance and ensure the longevity and durability of your electronic devices with the P6KE300(C)A transient voltage suppressor diode.

banner

Other Products

View More
  • Renesas Electronics America Inc ISL23418TFUZ-TK

    Renesas Electronics America Inc ISL23418TFUZ-TK

  • Analog Devices Inc. AD9164BBCA

    Analog Devices Inc. AD9164BBCA

  • MaxLinear, Inc. CDK3403CTQ48MTR

    MaxLinear, Inc. CDK3403CTQ48MTR

  • Analog Devices Inc. AD7537LPZ-REEL

    Analog Devices Inc. AD7537LPZ-REEL

  • Analog Devices Inc. AD7724ASTZ-REEL

    Analog Devices Inc. AD7724ASTZ-REEL

  • Analog Devices Inc./Maxim Integrated MAX188BCPP

    Analog Devices Inc./Maxim Integrated MAX188BCPP

  • Analog Devices Inc. LTC2377CDE-16#PBF

    Analog Devices Inc. LTC2377CDE-16#PBF

  • Analog Devices Inc. LTC2482IDD#PBF

    Analog Devices Inc. LTC2482IDD#PBF

  • Analog Devices Inc. AD7476BRT-REEL7

    Analog Devices Inc. AD7476BRT-REEL7

  • Analog Devices Inc. LTC2641IDD-12#TRPBF

    Analog Devices Inc. LTC2641IDD-12#TRPBF

  • Analog Devices Inc. LTC2619IGN-1#PBF

    Analog Devices Inc. LTC2619IGN-1#PBF

  • Texas Instruments AFE031AIRGZT

    Texas Instruments AFE031AIRGZT

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close