PCI9052G

Introducing the PCI9052G, an advanced and versatile peripheral component interconnect (PCI) bridge from a leading technology provider. Designed to meet the demands of high-performance industrial applications, the PCI9052G offers seamless connectivity and efficient data transfer capabilities. Featuring a robust architecture, the PCI9052G is equipped with a 32-bit PCI interface and a high-speed parallel interface, allowing for smooth communication between the host processor and peripheral devices. With a maximum transfer rate of up to 133MBps, data-intensive tasks are handled effortlessly, enhancing overall system performance. The PCI9052G boasts an array of advanced features, including an integrated DMA engine for direct memory access, scatter-gather capabilities, and master/target operation modes. These features enable efficient data transfer, reduce CPU usage, and facilitate the seamless integration of peripheral devices into the system. This high-performance PCI bridge is ideal for a wide range of applications, including industrial automation, data acquisition, networking, and more. Its rugged design ensures reliable operation even in demanding environments, while its easy-to-use and configurable interface simplifies system integration. Experience the power and reliability of the PCI9052G and unlock the full potential of your industrial applications.

banner

Other Products

View More
  • 478-BZ154B473ZSB-ND

    478-BZ154B473ZSB-ND

  • 490-16267-ND

    490-16267-ND

  • 399-10815-ND

    399-10815-ND

  • 493-4337-ND

    493-4337-ND

  • 4878PHBK-ND

    4878PHBK-ND

  • 2085-PBLH-12R0/87ST-ND

    2085-PBLH-12R0/87ST-ND

  • 3999-DRL226Q0TK25RR-ND

    3999-DRL226Q0TK25RR-ND

  • 478-SCMR22H155PRTB0-ND

    478-SCMR22H155PRTB0-ND

  • 283-2857-ND

    283-2857-ND

  • 478-BZ02CA903ZABBB-ND

    478-BZ02CA903ZABBB-ND

  • 399-17799-ND

    399-17799-ND

  • 283-5304-ND

    283-5304-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close