S29GL512S10TFI010

Introducing the S29GL512S10TFI010, a high-performance flash memory product designed to meet the demanding storage requirements of modern electronic devices. This 512-megabit flash memory offers a reliable and efficient solution for applications in automotive, industrial, and consumer electronics. With a 10 nanosecond access time and a maximum operating frequency of 100MHz, the S29GL512S10TFI010 allows for fast and seamless data transfer. Its advanced sector architecture offers flexible programming and erasing options, making it easier to manage data storage and updates. Equipped with a high-endurance floating gate technology, this flash memory product ensures data integrity and reliability over extended periods of use. Its extended temperature range of -40°C to +85°C and robust design make it suitable for even the harshest operating conditions. In addition, the S29GL512S10TFI010 comes with comprehensive security features, including password protection and hardware data protection, to safeguard sensitive information in embedded systems. With its low power consumption and efficient operation, this flash memory product contributes to longer battery life in portable devices. Trust the S29GL512S10TFI010 to deliver high-performance, durable, and secure flash memory for your applications.

banner

Other Products

View More
  • onsemi ADT7475ARQZ

    onsemi ADT7475ARQZ

  • onsemi ADM1030ARQZ-REEL7

    onsemi ADM1030ARQZ-REEL7

  • onsemi ADT7485AARMZ-R7

    onsemi ADT7485AARMZ-R7

  • onsemi ADT7473ARQZ-REEL7

    onsemi ADT7473ARQZ-REEL7

  • onsemi ADM1031ARQZ-R7

    onsemi ADM1031ARQZ-R7

  • NXP USA Inc. SE97TP,147

    NXP USA Inc. SE97TP,147

  • Analog Devices Inc./Maxim Integrated DS1629S-C05+T&R

    Analog Devices Inc./Maxim Integrated DS1629S-C05+T&R

  • onsemi ADT7473ARQZ

    onsemi ADT7473ARQZ

  • onsemi ADM1033ARQZ-REEL7

    onsemi ADM1033ARQZ-REEL7

  • Texas Instruments LM87CIMT

    Texas Instruments LM87CIMT

  • Analog Devices Inc./Maxim Integrated DS1780E

    Analog Devices Inc./Maxim Integrated DS1780E

  • Analog Devices Inc. ADM1030ARQ-REEL

    Analog Devices Inc. ADM1030ARQ-REEL

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close