TN80C188EB25

Introducing the TN80C188EB25, a versatile and high-performance microprocessor that is designed to meet the demanding requirements of various embedded applications. Powered by Intel's 16-bit 80C188 architecture, this product delivers a clock frequency of 25 MHz, enabling fast and efficient data processing. With its advanced features and robust design, the TN80C188EB25 is highly suited for applications ranging from industrial control systems to automotive electronics. It offers a wide range of integrated functions, including a powerful arithmetic logic unit, multiple serial communication interfaces, and an extensive set of timer and interrupt capabilities. The TN80C188EB25 is built to provide excellent performance while maintaining low power consumption. Its integrated power management features allow for optimized energy usage, making it ideal for battery-powered or energy-efficient devices. Featuring a robust development environment and a wide range of support tools, the TN80C188EB25 empowers developers to innovate and streamline their product design processes. Whether you are working on industrial automation, telecommunications, or medical devices, the TN80C188EB25 is the perfect choice to meet your performance and reliability requirements.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated MAX3140EEI

    Analog Devices Inc./Maxim Integrated MAX3140EEI

  • Diodes Incorporated PI7C9X762CZHE

    Diodes Incorporated PI7C9X762CZHE

  • Microchip Technology LAN83C185-JT

    Microchip Technology LAN83C185-JT

  • Microchip Technology USB5534BI4100JZXTR

    Microchip Technology USB5534BI4100JZXTR

  • Microchip Technology MCP251863T-E/9PXVAO

    Microchip Technology MCP251863T-E/9PXVAO

  • Microchip Technology LAN9252TV/ML

    Microchip Technology LAN9252TV/ML

  • Texas Instruments TUSB8020BPHP

    Texas Instruments TUSB8020BPHP

  • FTDI, Future Technology Devices International Ltd FT232HQ-TRAY

    FTDI, Future Technology Devices International Ltd FT232HQ-TRAY

  • Broadcom Limited BCM53106PKFBG

    Broadcom Limited BCM53106PKFBG

  • Microchip Technology USB2532I-1080AEN

    Microchip Technology USB2532I-1080AEN

  • Broadcom Limited BCM6368USQ01

    Broadcom Limited BCM6368USQ01

  • Texas Instruments TUSB4020BIPHP

    Texas Instruments TUSB4020BIPHP

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close