XC3S1600E-4FGG320C

Introducing the XC3S1600E-4FGG320C, a high-performance FPGA designed to cater to the ever-increasing demands of modern technological applications. Developed by industry-leading manufacturer, this cutting-edge product offers an optimal combination of power, flexibility, and scalability. The XC3S1600E-4FGG320C packs a punch with its impressive FPGA capabilities, boasting a generous 1600K logic cells. Its advanced architecture allows for seamless integration of complex designs, enabling engineers and developers to create versatile and robust systems with utmost ease. Featuring a maximum operating frequency of 500 MHz and a fast I/O response time, this FPGA offers lightning-fast data processing, enabling real-time performance in a wide array of applications such as high-speed communications, industrial automation, and image processing. Additionally, the XC3S1600E-4FGG320C comes equipped with an array of connectivity options including high-speed serial interfaces, Ethernet, and PCIe, ensuring seamless integration into existing systems. With its high performance, scalability, and advanced features, the XC3S1600E-4FGG320C is the ideal solution for engineers and developers looking to push the boundaries of their designs and bring innovation to the forefront.

banner

Other Products

View More
  • SG-9101CE-D20SGDCB-ND

    SG-9101CE-D20SGDCB-ND

  • 502NBD-ABAF-ND

    502NBD-ABAF-ND

  • 501BAC-ABAG-ND

    501BAC-ABAG-ND

  • SG-9101CA-D20SGBAC-ND

    SG-9101CA-D20SGBAC-ND

  • SG-9101CG-D40SHDCA-ND

    SG-9101CG-D40SHDCA-ND

  • 502PCD-ACAF-ND

    502PCD-ACAF-ND

  • SG-9101CE-C07PGAAA-ND

    SG-9101CE-C07PGAAA-ND

  • SG-9101CE-D15PHDBB-ND

    SG-9101CE-D15PHDBB-ND

  • SG-9101CG-C15PHACA-ND

    SG-9101CG-C15PHACA-ND

  • SG-9101CB-D30SHABB-ND

    SG-9101CB-D30SHABB-ND

  • 502JAA-ABAF-ND

    502JAA-ABAF-ND

  • SG-9101CE-D15PGAAC-ND

    SG-9101CE-D15PGAAC-ND

Related Blogs

  • 2026 / 05 / 15

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order

    Tower Semiconductor lands $1.3B silicon photonics deal for 2027, locking AI data center demand. Scaling CPO & optical interconnect capacity....

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order
  • 2026 / 05 / 14

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors

    ST launches TSB192 precision dual op-amp with 20µV offset and 8MHz bandwidth, alongside VD55G4/VD65G4 ultra-low-power global-shutter image sensors in the BrightSense family....

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors
  • 2026 / 05 / 13

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent

    Cmsemicon CMS25Q32A 32 Mbit SPI NOR Flash completes mass-production qualification, expanding its MCU-plus memory lineup for embedded, IoT and smart hardware....

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent
  • 2026 / 05 / 12

    Analysis and Selection Guide for Popular Electronic Components in May

    Driven by AI, EVs, and automation, demand surges for core components like MCUs, memory, PMICs, and RF chips in May 2026. This guide analyzes popular parts for selection....

    Analysis and Selection Guide for Popular Electronic Components in May
  • 2026 / 05 / 11

    Selection Guide: In-Depth Analysis of Voltage Reference ICs

    Voltage Reference ICs deliver ultra-stable, precision voltage outputs essential for ADC/DAC accuracy. Key specs include initial accuracy, temperature coefficient, and low-frequency noise. ...

    Selection Guide: In-Depth Analysis of Voltage Reference ICs
  • 2026 / 05 / 09

    Google Tensor G7 Chip: Continues with 2nm Process

    Google's upcoming Tensor G7 chip, manufactured by TSMC on a 2nm process, is set to power the Pixel 12 series. It continues Google's AI-first design philosophy......

    Google Tensor G7 Chip: Continues with 2nm Process
  • 2026 / 05 / 08

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets

    Global ICE automakers are divesting non-core manufacturing assets, while Chinese EV makers capitalize by acquiring idle overseas capacity to accelerate expansion....

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets
  • 2026 / 05 / 07

    Samsung Completely Exits the Chinese Home Appliance Market

    Samsung exits China's home appliance market effective May 6, 2026, halting sales of TVs, refrigerators, and more, while keeping its smartphone business. ...

    Samsung Completely Exits the Chinese Home Appliance Market
  • 2026 / 05 / 04

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs

    CMOS logic gate ICs form the foundation of digital circuits. They use complementary MOSFET pairs for near-zero static power, high noise immunity, and versatile voltage operation....

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs
  • 2026 / 04 / 30

    Amazon Rises to Top Three in Global Data Center Chip Market

    Amazon has become a top-three data center chip designer, with its in-house semiconductor business now generating over $20B annually....

    Amazon Rises to Top Three in Global Data Center Chip Market
Contact Information
close