AD7894ARZ-2REEL7

Introducing the AD7894ARZ-2REEL7, a high-performance, low-power, 12-bit ADC (Analog-to-Digital Converter) designed to cater to a wide range of applications. This versatile and efficient ADC is capable of converting analog signals into digital data with utmost precision and accuracy. The AD7894ARZ-2REEL7 boasts an impressive 12-bit resolution, ensuring that even the smallest of variations in the input signal are captured and converted into digital form faithfully. The device operates at a conversion rate of 500 kSPS (thousand samples per second), accelerating the process of analog to digital conversion. One of the notable features of the AD7894ARZ-2REEL7 is its low-power consumption, making it an ideal choice for portable and battery-operated devices. The device offers a power-down mode, further reducing power consumption during idle periods. This feature enhances overall energy efficiency and extends battery life. With its small form factor and ease of integration, the AD7894ARZ-2REEL7 is suitable for a wide range of applications, including industrial automation, medical instruments, data acquisition systems, and more. Additionally, it offers excellent linearity and robust performance even in demanding operating conditions. Join the cutting-edge technology revolution with the AD7894ARZ-2REEL7, bringing accuracy and efficiency to your digital conversion requirements.

banner

Other Products

View More
  • 1601-014126-ND

    1601-014126-ND

  • 1601-014946-ND

    1601-014946-ND

  • 1601-015015-ND

    1601-015015-ND

  • 1601-015026-ND

    1601-015026-ND

  • 1601-014694-ND

    1601-014694-ND

  • 1601-015043-ND

    1601-015043-ND

  • 1601-015085-ND

    1601-015085-ND

  • 1601-012614-ND

    1601-012614-ND

  • 1601-015039-ND

    1601-015039-ND

  • 1601-015106-ND

    1601-015106-ND

  • 1601-013520-ND

    1601-013520-ND

  • 1601-015257-ND

    1601-015257-ND

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close