AP20N15AGH-HF

Introducing the AP20N15AGH-HF, a high-performance power MOSFET designed to enhance the efficiency and reliability of your power electronics applications. This advanced N-channel MOSFET is ideal for a wide range of industrial and consumer applications, including power supplies, motor control, and lighting. The AP20N15AGH-HF features a low on-state resistance of just 20mΩ, allowing for efficient power conversion with minimal losses. With a drain-to-source voltage rating of 150V, it can handle high voltage applications with ease. Its low gate charge and fast switching times further enhance its performance, ensuring seamless operation in demanding environments. Built with advanced silicon technology, the AP20N15AGH-HF offers excellent thermal performance, reducing the risk of overheating and maximizing the lifespan of your devices. It also boasts a compact and robust package, making it easier to integrate into your designs and providing improved durability. With its superior electrical and thermal characteristics, the AP20N15AGH-HF is the perfect choice for engineers and designers looking to optimize their power electronics applications. Experience enhanced performance and efficiency with the AP20N15AGH-HF power MOSFET.

banner

Other Products

View More
  • Analog Devices Inc. LT4275AHDD#PBF

    Analog Devices Inc. LT4275AHDD#PBF

  • Texas Instruments LM5072MHX-50/NOPB

    Texas Instruments LM5072MHX-50/NOPB

  • Skyworks Solutions Inc. SI3459-B04-IM

    Skyworks Solutions Inc. SI3459-B04-IM

  • Analog Devices Inc. LTC4267IGN-3#TRPBF

    Analog Devices Inc. LTC4267IGN-3#TRPBF

  • Analog Devices Inc. LTC4292IUJ#PBF

    Analog Devices Inc. LTC4292IUJ#PBF

  • Skyworks Solutions Inc. SI3474A-A01-IM

    Skyworks Solutions Inc. SI3474A-A01-IM

  • Texas Instruments TPS23754PWPR

    Texas Instruments TPS23754PWPR

  • Analog Devices Inc./Maxim Integrated MAX5981AETE+T

    Analog Devices Inc./Maxim Integrated MAX5981AETE+T

  • Analog Devices Inc./Maxim Integrated MAX5945CAX+

    Analog Devices Inc./Maxim Integrated MAX5945CAX+

  • Skyworks Solutions Inc. SI3472B-A01-IMR

    Skyworks Solutions Inc. SI3472B-A01-IMR

  • Microchip Technology PD69208T4ILQ-TR-LE

    Microchip Technology PD69208T4ILQ-TR-LE

  • Analog Devices Inc. LTC4274AIUHF-2#PBF

    Analog Devices Inc. LTC4274AIUHF-2#PBF

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close