AUIRFR5505

Introducing the AUIRFR5505, a high-performance power MOSFET designed to meet the increasing demands of today's automotive applications. This new product offers enhanced thermal efficiency, reliability, and overall performance, making it the ideal choice for a wide range of automotive systems. The AUIRFR5505 features an advanced technology that allows for low on-resistance, reducing power losses and improving efficiency. With a maximum drain current rating of 75A and a breakdown voltage of 55V, this MOSFET delivers superior power handling capability and can withstand harsh environments. One of the key benefits of the AUIRFR5505 is its optimized thermal design. With a low thermal resistance, it effectively dissipates heat, allowing for higher power densities and extended component lifetimes. This feature ensures consistent functionality and reliability in demanding automotive applications. In addition, the AUIRFR5505 is designed with automotive reliability standards in mind. It complies with AEC-Q101 requirements, guaranteeing a high level of quality and durability. Whether used in engine control units, power distribution modules, or lighting systems, the AUIRFR5505 is your trusted power MOSFET solution for automotive applications. Experience the difference in performance and reliability with our latest product offering.

banner

Other Products

View More
  • 4118-IL-LMPMH-1K4K-ND

    4118-IL-LMPMH-1K4K-ND

  • 4118-IL-LMPMH-1K10K-ND

    4118-IL-LMPMH-1K10K-ND

  • 2657-10101822-ND

    2657-10101822-ND

  • 2657-CC22100-ND

    2657-CC22100-ND

  • 289-1114-ND

    289-1114-ND

  • 2657-11601320-ND

    2657-11601320-ND

  • 2657-11500210-ND

    2657-11500210-ND

  • 2657-29901300-ND

    2657-29901300-ND

  • 289-1154-ND

    289-1154-ND

  • 289-1003-ND

    289-1003-ND

  • 289-1166-ND

    289-1166-ND

  • 289-1040-ND

    289-1040-ND

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close