BTC2881M3

Introducing the BTC2881M3, the ultimate multimedia experience in one sleek and powerful device. This versatile product combines the functionality of a high-performance laptop with the portability and convenience of a tablet, giving you the best of both worlds. Equipped with a blazing fast Intel Core i5 processor and 8GB RAM, the BTC2881M3 delivers lightning-fast performance for all your computing needs. Whether you're browsing the web, streaming videos, or multitasking between applications, this device can handle it all with ease. Featuring a vibrant 12.5-inch full HD display, the BTC2881M3 offers crisp and clear visuals, making it perfect for watching movies, editing photos, or giving presentations. The integrated Intel HD Graphics ensures smooth and immersive graphics so you can enjoy your multimedia content to the fullest. With a generous 256GB SSD storage capacity, you'll have ample space to store all your important files, documents, and media. Plus, the BTC2881M3 comes with Windows 10 pre-installed, providing you with a familiar and user-friendly operating system. Designed with convenience in mind, this device is lightweight and compact, making it easy to take with you wherever you go. It also features a long-lasting battery life, so you can stay productive even when you're on the move. Experience the ultimate in multimedia performance and versatility with the BTC2881M3. Whether you're a student, a professional, or a casual user, this device is sure to impress with its power, portability, and stunning visuals.

banner

Other Products

View More
  • ABLIC Inc. S-8352A46MC-K3FT2G

    ABLIC Inc. S-8352A46MC-K3FT2G

  • ABLIC Inc. S-8333AAFA-T8T1G

    ABLIC Inc. S-8333AAFA-T8T1G

  • ABLIC Inc. S-8366ABAAA-I6T1U2

    ABLIC Inc. S-8366ABAAA-I6T1U2

  • Texas Instruments 5962-9455501MRA

    Texas Instruments 5962-9455501MRA

  • Texas Instruments UCC28C40DGK

    Texas Instruments UCC28C40DGK

  • Renesas Electronics America Inc ISL68301IRAZT7AR5825

    Renesas Electronics America Inc ISL68301IRAZT7AR5825

  • ABLIC Inc. S-8333CBDA-T8T1U

    ABLIC Inc. S-8333CBDA-T8T1U

  • Texas Instruments LM5141QURGERQ1

    Texas Instruments LM5141QURGERQ1

  • ABLIC Inc. S-8358F36MC-MKVT2U

    ABLIC Inc. S-8358F36MC-MKVT2U

  • Texas Instruments LM2737MTCX/NOPB

    Texas Instruments LM2737MTCX/NOPB

  • Intersil ISL8105ACRZ

    Intersil ISL8105ACRZ

  • Monolithic Power Systems Inc. MPQ3910AGK-AEC1-Z

    Monolithic Power Systems Inc. MPQ3910AGK-AEC1-Z

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close