EPM570T144C5N

Introducing the EPM570T144C5N, a cutting-edge product designed to meet all your electronic design requirements. This versatile and powerful programmable logic device (PLD) takes digital system design to the next level, offering outstanding performance and flexibility. The EPM570T144C5N boasts a massive capacity, with 70,000 logic elements and 5,348 Kbit memory. This ensures that it can handle even the most complex and demanding designs, allowing you to unleash your creativity without limitations. With 144-pin thin quad flat pack packaging, it is compact and space-efficient, making it ideal for various applications. This PLD offers advanced features like in-system programming, enabling you to reconfigure your design on-the-go without the need for expensive equipment. Additionally, it supports various interfaces like JTAG, making it compatible with popular programming tools. The EPM570T144C5N is designed to deliver exceptional performance, with high speed capabilities and low power consumption. It is ideal for a wide range of applications including industrial automation, telecommunications, automotive, and more. With its unmatched capabilities, the EPM570T144C5N PLD is the perfect solution for all your digital system design needs. Experience the power and flexibility it offers and revolutionize your designs today!

banner

Other Products

View More
  • PE-0805FT223JTT-ND

    PE-0805FT223JTT-ND

  • 5300-19-RC-ND

    5300-19-RC-ND

  • IMC1812EB27NM-ND

    IMC1812EB27NM-ND

  • 240-2617-2-ND,240-2617-1-ND,240-2617-6-ND

    240-2617-2-ND,240-2617-1-ND,240-2617-6-ND

  • MLG0603S3N6CT000-ND

    MLG0603S3N6CT000-ND

  • 2510-16K-ND

    2510-16K-ND

  • 0603HC-220EJTS-ND

    0603HC-220EJTS-ND

  • 0603HC-8N2EHTS-ND

    0603HC-8N2EHTS-ND

  • PM124SH-101M-RC-ND

    PM124SH-101M-RC-ND

  • 308-1504-2-ND,308-1504-1-ND,308-1504-6-ND

    308-1504-2-ND,308-1504-1-ND,308-1504-6-ND

  • RLB0608-3R9ML-ND

    RLB0608-3R9ML-ND

  • PA4310.564NLT-ND

    PA4310.564NLT-ND

Related Blogs

  • 2026 / 04 / 17

    ASML Capacity Plan: Doubling EUV Lithography Output by 2027

    ASML plans to double EUV lithography capacity by 2027, targeting 80 Low-NA systems annually, up from 44 in 2025....

    ASML Capacity Plan: Doubling EUV Lithography Output by 2027
  • 2026 / 04 / 16

    Kyocera's Strategic Acquisition of Ushio's Semiconductor Laser Business

    Kyocera acquires Ushio's semiconductor laser business for ~¥1B, completing its RGB laser diode portfolio. The deal strengthens GaAs-based red laser capabilities to complement existing GaN blue/green tech...

    Kyocera's Strategic Acquisition of Ushio's Semiconductor Laser Business
  • 2026 / 04 / 15

    Russia Imposes Helium Export Controls

    Russia imposed temporary helium export controls through end-2027, requiring special permits for shipments outside the EEU. ...

    Russia Imposes Helium Export Controls
  • 2026 / 04 / 14

    Japanese Government Approves Additional ¥631.5 Billion Subsidy for Rapidus

    Japanese government approved ¥631.5B additional subsidy for Rapidus. Funds target 2nm AI chip production for Fujitsu, with mass production planned for H2 FY2027....

    Japanese Government Approves Additional ¥631.5 Billion Subsidy for Rapidus
  • 2026 / 04 / 13

    Anthropic's "Claude Mythos" Model Triggers Global Financial Regulatory Storm

    Anthropic's Claude Mythos AI model autonomously discovered thousands of zero-day vulnerabilities, has triggered emergency regulatory responses from US and UK financial authorities...

    Anthropic's "Claude Mythos" Model Triggers Global Financial Regulatory Storm
  • 2026 / 04 / 10

    Red Hat Dismantles China R&D Team

    Red Hat is dismantling its China R&D team, affecting 500+ engineers. Operations cease April 2026, with work transferred to Asia-Pacific hubs...

    Red Hat Dismantles China R&D Team
  • 2026 / 04 / 09

    Infineon and GTA Semiconductor Forge Deeper Alliance in Embedded Memory

    Infineon and GTA Semiconductor deepened their strategic partnership on April 2, 2026, focusing on embedded non-volatile memory technologies. ...

    Infineon and GTA Semiconductor Forge Deeper Alliance in Embedded Memory
  • 2026 / 04 / 08

    AC/DC and DC/DC Converters Explained: Core Components of Power Conversion

    AC/DC and DC/DC converters transform electrical energy for electronic devices. Modern GaN technology achieves 98% efficiency, enabling compact, high-performance power solutions....

    AC/DC and DC/DC Converters Explained: Core Components of Power Conversion
  • 2026 / 04 / 07

    Broadcom Secures Future AI Chip Production Orders from Google

    Broadcom secures Google's future AI chip production, extending TPU partnership to 2031. Anthropic joins with 3.5GW TPU deal for 2027....

    Broadcom Secures Future AI Chip Production Orders from Google
  • 2026 / 04 / 03

    Twin Troubles: Nokia and Ericsson Announce Global Layoffs

    Nokia and Ericsson Global Layoffs. Nokia plans 4,100 layoffs to save €1.2B. Ericsson will continue 2025's 5,000-job reduction pace, including 1,600 cuts in Sweden. ...

    Twin Troubles: Nokia and Ericsson Announce Global Layoffs
Contact Information
close