China's CIS Leader SmartSens Announces Price Increases
On February 26, 2026, SmartSens, a leading domestic CMOS image sensor (CIS) company in China, officially issued price increase notifications to its partners, announcing differentiated price adjustments for select CMOS products in its two core application areas-smart security and ...
Semiconductor Devices: In-Depth Analysis of Digital Isolators
In modern electronic systems, electrical isolation serves as a fundamental technology ensuring equipment reliability and personnel safety. The Digital Isolator, a high-performance semiconductor device fabricated with CMOS technology, enables secure transmission of digital signals through semiconduct...
Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12
Samsung Electronics is accelerating its strategic transformation in the memory chip business. The company will officially cease 2D NAND flash production at its Hwaseong Campus Line 12 as early as March 2026. With a monthly capacity of 80,000 to 100,000 12-inch wafers, the production line will b...
Nexperia China Full Transition its power semiconductors to domestically produced wafers
In October 2025, the Dutch government froze Wingtech Technology's equity stake in Nexperia Semiconductors under the pretext of "national security" and severed wafer supplies to the Dongguan facility, leaving the plant—which handles 70% of global automotive-grade packaging and...
Micron Officially Enters the GDDR7 3GB Competition
Memory giant Micron Technology has officially joined the competition for 3GB GDDR7 memory modules by launching its 3GB capacity GDDR7 memory chips.Previously, Samsung was the first to introduce 3GB GDDR7 modules with a maximum bandwidth of 42.5Gbps. SK Hynix has also confirmed it is develo...
AI Computing Power Ignites Passive Components: MLCC Price Increases
Global multilayer ceramic capacitor (MLCC) leader Murata Manufacturing recently released a pivotal signal. President Norio Nakajima publicly disclosed that the company has initiated substantive internal discussions regarding price adjustments, with plans to make a final decision on whether to raise ...
TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS
Leading foundry TSMC is accelerating its capacity restructuring and fully phasing out of the mature process domain. According to sources, TSMC currently maintains an annual 8-inch capacity of approximately 5 million wafers, of which about 80% (4 million wafers) will be progressively transferred to i...
