Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM
In March 2026, Japanese automotive components supplier DENSO formally submitted a full acquisition proposal to semiconductor manufacturer ROHM, with the transaction valued at approximately ¥1.3 trillion (around $8.2 billion). Should the deal materialize, the two companies would form a domestic Japan...
ASML Strategic Planning: Potential Expansion into Advanced Packaging
Dutch semiconductor equipment giant ASML is formulating a long-term strategy to extend its business footprint from the extreme ultraviolet (EUV) lithography domain into the advanced packaging and chip bonding equipment markets. In an interview, ASML Chief Technology Officer Marco Pieters explicitly ...
Hot Chip Guide: In-Depth Analysis of IC Component
From the real-time responsiveness of microcontrollersto the parallel acceleration of FPGAs, from the weak signal capture of precision sensors to the efficient energy conversion of power devices, each category of chip plays an irreplaceable role in specific technical scenarios. This article presents ...
KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months
In early March 2026, KEMET, a subsidiary of passive component giant Yageo, formally issued price increase notification letters to customers, announcing adjustments to its KO-CAP polymer tantalum capacitor product line, specifically the T523 series. The new pricing will take effect on April 1, 2026. ...
China's CIS Leader SmartSens Announces Price Increases
On February 26, 2026, SmartSens, a leading domestic CMOS image sensor (CIS) company in China, officially issued price increase notifications to its partners, announcing differentiated price adjustments for select CMOS products in its two core application areas-smart security and ...
Semiconductor Devices: In-Depth Analysis of Digital Isolators
In modern electronic systems, electrical isolation serves as a fundamental technology ensuring equipment reliability and personnel safety. The Digital Isolator, a high-performance semiconductor device fabricated with CMOS technology, enables secure transmission of digital signals through semiconduct...
Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12
Samsung Electronics is accelerating its strategic transformation in the memory chip business. The company will officially cease 2D NAND flash production at its Hwaseong Campus Line 12 as early as March 2026. With a monthly capacity of 80,000 to 100,000 12-inch wafers, the production line will b...
