L2N7002WT1G

Introducing the L2N7002WT1G, a high-performance, low-voltage N-channel MOSFET designed to meet the ever-increasing demands of the modern electronics industry. This powerful transistor offers efficient and reliable performance, making it an ideal choice for a wide range of applications. The L2N7002WT1G is specifically designed to operate at low voltages, which makes it perfect for portable devices, IoT applications, and battery-powered systems. With a maximum drain current of 200 mA and a low on-state resistance, this MOSFET delivers exceptional power efficiency while minimizing heat dissipation. Featuring a compact and highly reliable SOT-323 package, the L2N7002WT1G is easy to integrate into your circuit board design. Its low gate threshold voltage and fast switching speed ensure quick response times, making it suitable for applications requiring high-frequency switching. Additionally, the L2N7002WT1G is built to last. With a maximum continuous drain voltage of 60V, it offers exceptional durability and longevity even in demanding operating conditions. In conclusion, the L2N7002WT1G MOSFET provides excellent performance, reliability, and versatility for a range of low-voltage applications. Upgrade your electronic designs with the L2N7002WT1G and experience superior power efficiency and durability.

banner

Other Products

View More
  • Texas Instruments TMS32C6415EGLZ6E3

    Texas Instruments TMS32C6415EGLZ6E3

  • Intel EP2A25B724-C7

    Intel EP2A25B724-C7

  • Intel EP3SE110F1152I4LG

    Intel EP3SE110F1152I4LG

  • Lattice Semiconductor Corporation LCMXO1200C-5FTN256C

    Lattice Semiconductor Corporation LCMXO1200C-5FTN256C

  • Intel 5SGXMB5R2F40I3LG

    Intel 5SGXMB5R2F40I3LG

  • STMicroelectronics STM32MP151CAD3T

    STMicroelectronics STM32MP151CAD3T

  • NXP USA Inc. LS2044AXE7V1B

    NXP USA Inc. LS2044AXE7V1B

  • Infineon Technologies MB89935BPFV-G-219-ERE1

    Infineon Technologies MB89935BPFV-G-219-ERE1

  • Texas Instruments AM5708BCBDJEAR

    Texas Instruments AM5708BCBDJEAR

  • NXP USA Inc. XPC8260CZUIHBC

    NXP USA Inc. XPC8260CZUIHBC

  • AMD XCZU3EG-1UBVA530E

    AMD XCZU3EG-1UBVA530E

  • Infineon Technologies MB90547GHDSPQC-G-207ERE2

    Infineon Technologies MB90547GHDSPQC-G-207ERE2

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close