LSRV04W-4DT1G

Introducing the LSRV04W-4DT1G, a revolutionary product designed to enhance your lighting experience. This cutting-edge product combines advanced features with a sleek design to provide unparalleled illumination in any space. The LSRV04W-4DT1G is equipped with a unique tri-color LED technology, allowing you to choose between different light temperatures - warm, cool, or daylight - to create the perfect ambiance for any occasion. Whether you're hosting a dinner party, studying, or simply relaxing, this product has the right setting for you. With its 4-inch size, this slim and compact downlight is perfect for any room in your home or office. Installation is a breeze thanks to the integrated mounting brackets, and the versatile design allows for both recessed and surface mounting options. Not only does the LSRV04W-4DT1G provide exceptional lighting, but it also boasts energy-saving capabilities. The LED technology ensures a longer lifespan and helps reduce energy consumption, making it an environmentally friendly choice. Upgrade your lighting to a whole new level of versatility and efficiency with the LSRV04W-4DT1G. Experience superior illumination and create the perfect atmosphere for any space with this exceptional product.

banner

Other Products

View More
  • 283-3130-ND

    283-3130-ND

  • 2485-LMT055224A-ND

    2485-LMT055224A-ND

  • DZ-2R5D306K9T-ND

    DZ-2R5D306K9T-ND

  • 399-10816-ND

    399-10816-ND

  • 399-10800-ND

    399-10800-ND

  • 4703PHBK-ND

    4703PHBK-ND

  • 478-BWB295273ZSBA2-ND

    478-BWB295273ZSBA2-ND

  • MAL219691224E3-ND

    MAL219691224E3-ND

  • 157DER2R5SCP-ND

    157DER2R5SCP-ND

  • 1572-1761-ND

    1572-1761-ND

  • 399-13097-2-ND,399-13097-1-ND,399-13097-6-ND

    399-13097-2-ND,399-13097-1-ND,399-13097-6-ND

  • 1572-1772-ND

    1572-1772-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close