MTN3N60BFP

Introducing the MTN3N60BFP, our latest and state-of-the-art power MOSFET designed to cater to the growing needs of various electrical applications. This product offers a remarkable combination of reliability, efficiency, and high-performance capabilities. With a voltage rating of 600V and a current rating of 3A, the MTN3N60BFP is an ideal choice for power supply units, motor control systems, and other industrial applications. Its low switching and conduction losses contribute to improved system efficiency, saving energy and reducing operating costs. This power MOSFET boasts a low gate charge and gate-to-drain charge, making it suitable for high-frequency switching applications. Furthermore, its robust and compact design ensures enhanced thermal performance and easy integration into compact electronic assemblies. The MTN3N60BFP is meticulously crafted using advanced materials and adheres to the highest quality standards, guaranteeing exceptional reliability and durability. Its versatility, efficiency, and performance make it a must-have component for engineers and designers looking to elevate their electrical systems to new levels. Trust the MTN3N60BFP for unmatched power control and efficiency in your next project.

banner

Other Products

View More
  • Intersil ISL8014AIRZ-TS2378

    Intersil ISL8014AIRZ-TS2378

  • Texas Instruments UC2833DWTR

    Texas Instruments UC2833DWTR

  • Analog Devices Inc./Maxim Integrated MAX8564AEUB+

    Analog Devices Inc./Maxim Integrated MAX8564AEUB+

  • National Semiconductor L1087MPX-3.3/NOPB

    National Semiconductor L1087MPX-3.3/NOPB

  • Texas Instruments UC3836D

    Texas Instruments UC3836D

  • Analog Devices Inc./Maxim Integrated MAX8875EZK29

    Analog Devices Inc./Maxim Integrated MAX8875EZK29

  • Microchip Technology MIC5191BMM-TR

    Microchip Technology MIC5191BMM-TR

  • Micrel Inc. MIC5245-3.2M5 TR

    Micrel Inc. MIC5245-3.2M5 TR

  • Semtech Corporation SC1548CSK-1.5TR

    Semtech Corporation SC1548CSK-1.5TR

  • ABLIC Inc. S-816A35AMC-BAKT2U

    ABLIC Inc. S-816A35AMC-BAKT2U

  • ABLIC Inc. S-816A36AMC-BALT2G

    ABLIC Inc. S-816A36AMC-BALT2G

  • Rohm Semiconductor BD3501FVM-TR

    Rohm Semiconductor BD3501FVM-TR

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close