Qfn Package

Introducing our latest product in QFN package – the QFN-28. This high-performance package offers a compact and space-saving solution for all your semiconductor needs. With 28 leadless pins and a low profile, the QFN-28 is designed to maximize thermal performance and electrical connectivity while minimizing the overall size of the package. The QFN-28 package is ideal for a wide range of applications including integrated circuits, microcontrollers, RF amplifiers, and more. Its leadless design allows for a smaller footprint on the PCB, enabling higher density and miniaturization in electronic designs. The exposed thermal pad also provides excellent heat dissipation, making it suitable for high-power applications. Engineered for reliability and performance, our QFN-28 package is RoHS compliant and designed to meet the stringent demands of today’s electronic devices. Trust our QFN-28 package to deliver exceptional performance and space-saving design for your next semiconductor project.