TM4C1290NCPDTT3

Introducing the TM4C1290NCPDTT3, a powerful and versatile microcontroller designed to meet the demands of today's embedded systems. With its advanced features and exceptional performance, this product is perfect for a wide range of applications, from industrial automation to smart home devices. The TM4C1290NCPDTT3 boasts a high-performance ARM Cortex-M4 core, running at up to 120 MHz. This allows for quick and efficient execution of complex tasks, ensuring your applications run smoothly and efficiently. It also offers extensive connectivity options, including Ethernet, USB, and I2C, enabling seamless integration with other devices and networks. This microcontroller features a generous 1MB of Flash memory and 256KB of SRAM, providing ample space for your code and data. Its low-power design ensures energy efficiency, making it ideal for battery-powered applications. Additionally, it offers a wide operating temperature range, ensuring reliable operation in extreme conditions. With a wide variety of peripherals, such as GPIO, PWM, and ADC, the TM4C1290NCPDTT3 gives you the flexibility to connect and control external devices. Its robust design and comprehensive software support make it easy to develop and deploy your applications. In conclusion, the TM4C1290NCPDTT3 is a feature-rich microcontroller that delivers exceptional performance, connectivity, and versatility. Whether you're developing a sophisticated IoT device or a simple control system, this product is the perfect choice.

banner

Other Products

View More
  • 2368-505-0008-ND

    2368-505-0008-ND

  • H-492-3-ND

    H-492-3-ND

  • 693-18A21B1031812-ND

    693-18A21B1031812-ND

  • 2126BI-ND

    2126BI-ND

  • 3412KL-ND

    3412KL-ND

  • 693-1008-ND

    693-1008-ND

  • 2368-503-0005-ND

    2368-503-0005-ND

  • 2368-505-0003-ND

    2368-505-0003-ND

  • 716-23A21B10-ND

    716-23A21B10-ND

  • 28A21B10-ND

    28A21B10-ND

  • 987-1654-ND

    987-1654-ND

  • P0400-83-ND

    P0400-83-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close