XC2C512-10FT256I

Introducing the XC2C512-10FT256I, a cutting-edge programmable logic device that brings unparalleled flexibility and performance to your digital designs. Developed by Xilinx, a trusted name in the field of FPGA technology, this device is designed to meet the complex requirements of today's dynamic industry demands. The XC2C512-10FT256I offers an impressive combination of high-speed performance and abundant logic resources, making it ideal for a wide range of applications such as telecommunications, automotive, and industrial control systems. Its advanced architecture allows for rapid prototyping, enabling you to rapidly iterate and optimize your designs. Featuring a generous capacity of 512K system gates and 10ns maximum delay time, this device provides you with ample room to implement complex logic functions while maintaining exceptional performance. The integrated DDR memory interface ensures efficient data transfer, while the numerous I/O pins allow for seamless integration with other devices. Designed for ease of use, the XC2C512-10FT256I offers a friendly programming environment that simplifies the development process. Furthermore, the device is backed by Xilinx's comprehensive support and documentation, ensuring that you have all the resources you need to bring your designs to life. Experience the power of secure and reliable programmable logic with the XC2C512-10FT256I. Trust Xilinx to deliver the performance and versatility you need to stay ahead in today's ever-evolving technological landscape.

banner

Other Products

View More
  • 18S-10-ND

    18S-10-ND

  • 2128E-ND

    2128E-ND

  • 6012E-ND

    6012E-ND

  • 716-ACCRFCOLLRSSD10AAV-ND

    716-ACCRFCOLLRSSD10AAV-ND

  • HEIKIT1041000E29-ND

    HEIKIT1041000E29-ND

  • 716-ACCRF2EHU-ND

    716-ACCRF2EHU-ND

  • 2175E-ND

    2175E-ND

  • BRACKET206-ND

    BRACKET206-ND

  • 2485-5900E-ND

    2485-5900E-ND

  • 541-10222-ND

    541-10222-ND

  • 7PA20-ND

    7PA20-ND

  • 6111A-EN-170E-ND

    6111A-EN-170E-ND

Related Blogs

  • 2025 / 10 / 16

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead

    Samsung Electronics is making significant strides in memory technology. It aims to achieve over 3TB/s bandwidth with its seventh-generation HBM4E by 2027, a 2.5x improvement over current HBM3E......

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead
  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
  • 2025 / 10 / 11

    What Is a Voltage-Level Translator?

    Voltage-level translators, also known as level shifters, are crucial for enabling communication between electronic devices operating at different voltage levels. They prevent signal distortion and equipment damage by converting signal voltages accurately. ...

    What Is a Voltage-Level Translator?
  • 2025 / 10 / 10

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers

    NVIDIA has significantly increased its orders for 800G optical modules for 2026, with a 35% rise in demand. The growing need for high-speed optical modules in data centers, driven by AI, highlights the importance of 800G modules....

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers
  • 2025 / 10 / 09

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio

    Altera is expanding its Agilex™ FPGA portfolio with new hardware and software solutions. The Agilex 5 and Agilex 3 SoC FPGAs are now in mass production, offering low latency and high integration for edge AI and co-processing applications. ...

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio
  • 2025 / 09 / 30

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off

    ST brings next-gen Panel-Level Packaging to Tours: $60M pilot line starts Q3-2026, boosting throughput and cutting cost....

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off
  • 2025 / 09 / 29

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation

    ARM Technology has launched the third-generation high-energy-efficient embedded chip IP, "Stellar" STAR-MC3, significantly enhancing MCU AI processing capabilities. ...

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation
  • 2025 / 09 / 28

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance

    AMD's new patent for High Bandwidth Dual In-line Memory Module (HB-DIMM) represents a significant leap in DDR5 memory technology. ...

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance
Contact Information
close