XC3S500E-4FTG256C

Introducing the XC3S500E-4FTG256C, a high-performance and efficient FPGA device designed for a wide range of applications. This product combines the power of a Field Programmable Gate Array (FPGA) with the advanced features of the XC3S500E family, making it a versatile choice for designers and developers. The XC3S500E-4FTG256C offers a generous capacity of 500,000 system gates, enabling users to implement complex logic functions and algorithms with ease. It also features a customizable logic array, providing flexibility in optimizing the device for specific design requirements. With a speed grade of -4, this FPGA supports clock frequencies of up to 300 MHz, allowing for rapid data processing and efficient system performance. Additionally, the XC3S500E-4FTG256C boasts an embedded PowerPC® processor, further enhancing its processing capabilities. Designed to meet the demanding requirements of a variety of industries, including telecommunications, automotive, consumer electronics, and more, the XC3S500E-4FTG256C offers unparalleled reliability and performance. With its powerful features and compact form factor, this FPGA is ideal for innovative and resource-intensive applications. Start your next design project with the XC3S500E-4FTG256C and unlock endless possibilities.

banner

Other Products

View More
  • 1608L128-ND

    1608L128-ND

  • 1656L3A44-ND

    1656L3A44-ND

  • 1656L459-ND

    1656L459-ND

  • 1611F030-ND

    1611F030-ND

  • 1655L0A51-ND

    1655L0A51-ND

  • 1611F339-ND

    1611F339-ND

  • XT04AAR5ENJD490-ND

    XT04AAR5ENJD490-ND

  • 1655L139-ND

    1655L139-ND

  • 1656L0A31-ND

    1656L0A31-ND

  • 1610L657-ND

    1610L657-ND

  • 1949-SCMT-50K6G-28-20-M14-ND

    1949-SCMT-50K6G-28-20-M14-ND

  • 1655L119-ND

    1655L119-ND

Related Blogs

  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
Contact Information
close