AD8139ACPZ

Introducing the AD8139ACPZ, an advanced operational amplifier from Analog Devices, designed to deliver exceptional performance in demanding video and high-speed data applications. The AD8139ACPZ offers a wide range of features, making it an ideal choice for professionals looking to achieve superior signal integrity and precision. With a bandwidth of 4 GHz and a slew rate of 6000 V/μs, this amplifier ensures accurate and high-speed signal transmission, enabling crystal-clear video and seamless data transmission. The AD8139ACPZ also boasts a low distortion of -62 dBc and a fast settling time of 7 ns, ensuring precise amplification and reduced signal degradation. Furthermore, this operational amplifier supports single-ended or differential input signals, providing versatility and compatibility with various system configurations. Its differential output and common-mode rejection ratio of 48 dB enable precise amplification without interference from common-mode noise, delivering a crisp and accurate output signal. Designed for ease of use, the AD8139ACPZ is available in a compact and thermally efficient LFCSP package, allowing for easy integration into space-constrained designs. With its exceptional performance and versatile features, the AD8139ACPZ is the perfect choice for high-speed data transmission and professional video applications.

banner

Other Products

View More
  • DSC-TIMEFLASH-KIT-ND

    DSC-TIMEFLASH-KIT-ND

  • 535-10952-ND

    535-10952-ND

  • 576-4825-ND

    576-4825-ND

  • 1473-1000-ND

    1473-1000-ND

  • 535-10056-ND

    535-10056-ND

  • 535-10058-ND

    535-10058-ND

  • DSC-TIMEFLASH2-KIT2-ND

    DSC-TIMEFLASH2-KIT2-ND

  • DSC-TIMEFLASH2-KIT1-ND

    DSC-TIMEFLASH2-KIT1-ND

  • 576-4824-ND

    576-4824-ND

  • PG-4000-ND

    PG-4000-ND

  • PG-3000-ND

    PG-3000-ND

  • SI2417FT18-EVB-ND

    SI2417FT18-EVB-ND

Related Blogs

  • 2025 / 10 / 16

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead

    Samsung Electronics is making significant strides in memory technology. It aims to achieve over 3TB/s bandwidth with its seventh-generation HBM4E by 2027, a 2.5x improvement over current HBM3E......

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead
  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
  • 2025 / 10 / 11

    What Is a Voltage-Level Translator?

    Voltage-level translators, also known as level shifters, are crucial for enabling communication between electronic devices operating at different voltage levels. They prevent signal distortion and equipment damage by converting signal voltages accurately. ...

    What Is a Voltage-Level Translator?
  • 2025 / 10 / 10

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers

    NVIDIA has significantly increased its orders for 800G optical modules for 2026, with a 35% rise in demand. The growing need for high-speed optical modules in data centers, driven by AI, highlights the importance of 800G modules....

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers
  • 2025 / 10 / 09

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio

    Altera is expanding its Agilex™ FPGA portfolio with new hardware and software solutions. The Agilex 5 and Agilex 3 SoC FPGAs are now in mass production, offering low latency and high integration for edge AI and co-processing applications. ...

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio
  • 2025 / 09 / 30

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off

    ST brings next-gen Panel-Level Packaging to Tours: $60M pilot line starts Q3-2026, boosting throughput and cutting cost....

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off
  • 2025 / 09 / 29

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation

    ARM Technology has launched the third-generation high-energy-efficient embedded chip IP, "Stellar" STAR-MC3, significantly enhancing MCU AI processing capabilities. ...

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation
  • 2025 / 09 / 28

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance

    AMD's new patent for High Bandwidth Dual In-line Memory Module (HB-DIMM) represents a significant leap in DDR5 memory technology. ...

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance
Contact Information
close