EPM240M100C4N

Introducing the EPM240M100C4N, a cutting-edge programmable logic device designed to deliver unparalleled performance and versatility. This product is the result of years of research and development, harnessing the latest advancements in embedded technology to provide a powerful platform for designing and implementing complex digital systems. Featuring a generous capacity of 240 macrocells, the EPM240M100C4N offers ample resources to accommodate even the most demanding application requirements. Its advanced architecture boasts high-speed performance, enabling the quick execution of complex logic functions with minimal latency. This makes it ideal for a wide range of applications, including industrial control systems, telecommunications equipment, and automotive electronics. Designed with ease of use in mind, this programmable logic device offers a comprehensive set of development tools and resources. These include design software that simplifies the creation of complex digital circuits, as well as a range of pre-designed IP cores that can help accelerate project development. When it comes to reliability, the EPM240M100C4N excels. Its robust construction and stringent testing procedures ensure that the device operates flawlessly even in harsh operating conditions. With its low power consumption, this product is also environmentally friendly and cost-effective. Discover the limitless possibilities of digital design with the EPM240M100C4N – the ultimate programmable logic device for power and performance.

banner

Other Products

View More
  • System-On-Chip (SOC) Technologies Inc. EC-VA-H264-8B-30-1080-MXC-ZL

    System-On-Chip (SOC) Technologies Inc. EC-VA-H264-8B-30-1080-MXC-ZL

  • Trenz Electronic GmbH TE0726-03R

    Trenz Electronic GmbH TE0726-03R

  • BECOM Systems GmbH 100-1225-1

    BECOM Systems GmbH 100-1225-1

  • Trenz Electronic GmbH TE0841-02-41C21-A

    Trenz Electronic GmbH TE0841-02-41C21-A

  • Trenz Electronic GmbH TE0715-04-71C33-A

    Trenz Electronic GmbH TE0715-04-71C33-A

  • Trenz Electronic GmbH TE0300-01IBMLP

    Trenz Electronic GmbH TE0300-01IBMLP

  • Intel CYCLONE 10 LP

    Intel CYCLONE 10 LP

  • Digi 20-101-1215

    Digi 20-101-1215

  • NXP USA Inc. MOD5270BXCE

    NXP USA Inc. MOD5270BXCE

  • Beacon EmbeddedWorks SOMM5485-MED01-0201R-A

    Beacon EmbeddedWorks SOMM5485-MED01-0201R-A

  • Trenz Electronic GmbH TE0820-04-2BI21FL

    Trenz Electronic GmbH TE0820-04-2BI21FL

  • Lantronix, Inc. XPP100300S-04R

    Lantronix, Inc. XPP100300S-04R

Related Blogs

  • 2026 / 02 / 11

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS

    TSMC transfers 80% of its 8-inch capacity to VIS, exiting mature processes to focus on AI-driven advanced nodes below 3nm, while VIS doubles capacity to dominate the global 8-inch foundry market....

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS
  • 2026 / 02 / 10

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"

    Sharp will close its LCD subsidiary Sharp Yonago by July 2026. The move follows the 2024 shutdown of its Sakai factory and plans to sell the Kameyama No. 2 plant....

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"
  • 2026 / 02 / 09

    Renesas Electronics Reports First Loss in Six Years, Divests Timing Business for $3 Billion

    Renesas Electronics forecasts its first net loss in six years (¥51.7B) for FY2025 due to Wolfspeed's bankruptcy impairment and weak automotive demand. ...

    Renesas Electronics Reports First Loss in Six Years, Divests Timing Business for $3 Billion
  • 2026 / 02 / 07

    ADUM Series Digital Isolators: Technical Analysis, Model Selection, and Application Guide

    The ADUM series digital isolators from Analog Devices utilize proprietary iCoupler® technology with on-chip transformers, offering superior performance over traditional optocouplers. ...

    ADUM Series Digital Isolators: Technical Analysis, Model Selection, and Application Guide
  • 2026 / 02 / 05

    Infineon Acquires ams OSRAM Sensor Business for €570 Million

    Infineon acquires ams OSRAM's non-optical sensor business for €570M. The deal strengthens Infineon's automotive, industrial and medical sensor portfolio....

    Infineon Acquires ams OSRAM Sensor Business for €570 Million
  • 2026 / 02 / 04

    TI Eyes $7 Billion Acquisition of Silicon Labs

    TI is in advanced talks to acquire Silicon Labs for $7B, its largest deal since 2011. The acquisition would bolster TI's IoT capabilities with Silicon Labs' wireless connectivity expertise....

    TI Eyes $7 Billion Acquisition of Silicon Labs
  • 2026 / 02 / 03

    The Pause Button: ST-GF Joint Venture and Sumitomo Electric's SiC Project

    Global semiconductor construction faces a rare halt wave: ST-GF' €7.5B FD-SOI fab in France stalls, while Sumitomo Electric cancels its ¥30B SiC project....

    The Pause Button: ST-GF Joint Venture and Sumitomo Electric's SiC Project
  • 2026 / 02 / 02

    $15B Comeback! Tower Semiconductor's Market Cap Soars

    Tower's market cap has surged past $15 billion, tripling Intel's abandoned $5 billion bid. Driven by silicon photonics demand for AI data centers, the stock jumped 160% in six months....

    $15B Comeback! Tower Semiconductor's Market Cap Soars
  • 2026 / 01 / 30

    Hot-Selling Chip Procurement Guide: In-Depth Analysis of Five Popular Devices

    Five hot-selling chips: TI PMIC, STM32 MCU, Micron NOR Flash, ADI PLL, and Microchip EEPROM-covering power, control, storage, RF, and data applications....

    Hot-Selling Chip Procurement Guide: In-Depth Analysis of Five Popular Devices
  • 2026 / 01 / 29

    SK Hynix Commits $10 Billion to Restructure Solidigm

    SK Hynix commits $10B to restructure Solidigm into AI Co., transforming from memory supplier to AI solutions provider. ...

    SK Hynix Commits $10 Billion to Restructure Solidigm
Contact Information
close