IBM and Together AI Sign $240 Million Agreement
On August 11, 2026, IBM and Together AI officially signed a multi-year cooperation agreement worth $240 million. The two parties will deploy a large-scale AI computing cluster on IBM Cloud, dedicated to inference services for open-source AI models. The cluster is expected to go live in Q1 2027.Strat...
Intel Raises $15 Billion to Accelerate Chip Manufacturing
On August 10, Intel announced plans for an underwritten public offering of $15 billion in common stock to strengthen its financial position and support future business expansion. The offering is jointly led by JPMorgan, Goldman Sachs, Morgan Stanley, and Citigroup as bookrunners, with underwriters g...
Teledyne to Acquire Varex Imaging for $1.1 Billion
On August 10, 2026, Teledyne Technologies Incorporated and Varex Imaging Corporation jointly announced that they have entered into a definitive acquisition agreement. Teledyne will acquire all outstanding shares of Varex in an all-cash transaction at $18.90 per share, representing a total transactio...
SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
On August 7, SK Hynix announced a new fab investment plan totaling 54 trillion won, with 35.2 trillion won allocated to the Yongin Y2 facility and 19.1 trillion won to the Cheongju M17 facility. According to Omdia forecasts, the global DRAM and NAND flash memory market is expected to grow at a compo...
TI TPSM Series Power Modules – Selection Guide
TI's TPSM series power modules employ a highly integrated synchronous buck architecture that combines controllers, power MOSFETs, inductors, and passive components into a single package. This significantly streamlines power supply design and reduces PCB footprint. The TPSM family covers a comple...
All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
On August 4, supply chain sources revealed that Samsung Electronics, SK Hynix, and Micron have completed negotiations for the full-year 2027 DRAM and HBM capacity allocation, with all capacity fully sold out. The allocation targets two customer categories. First, CSPs and major AI chip clients that ...
SK hynix And Sandisk Release HBF First Standard Specification
On August 4, 2026, SK Hynix and SanDisk jointly released the first industry standard specification for the next-generation storage technology - High Bandwidth Flash (HBF). This specification was officially made public by the world's largest open data center technology cooperation organization, O...
