GAL20V8B-15LJ

Introducing GAL20V8B-15LJ, the ultimate compact logic array device designed for high-performance applications. This product is engineered to deliver exceptional functionality and versatility, making it the perfect solution for a wide range of digital designs. Featuring advanced technology and a low power consumption design, GAL20V8B-15LJ offers superior performance without compromising on efficiency. With its 22 input and 8 output pins, this device provides exceptional flexibility for complex logic functions. Whether you need to implement combinatorial or sequential logic, GAL20V8B-15LJ has got you covered. The GAL20V8B-15LJ also boasts a maximum propagation delay of just 15ns, ensuring rapid response times and improved overall system performance. Additionally, its non-volatile configuration memory eliminates the need for external complex programming devices, simplifying the system integration process. Designed for ease of use, GAL20V8B-15LJ is conveniently packaged in a compact 20-pin LCC form factor, allowing for seamless integration into your existing designs. Reliable, efficient, and versatile, this product is the ideal choice for a wide range of applications, including telecommunications, industrial automation, and consumer electronics. Experience the power and performance of GAL20V8B-15LJ and take your digital designs to new heights.

banner

Other Products

View More
  • 711-1382-ND

    711-1382-ND

  • 711-1231-ND

    711-1231-ND

  • C12222_BERTHA1-TYPE4-M-BASE-ND

    C12222_BERTHA1-TYPE4-M-BASE-ND

  • 711-1285-ND

    711-1285-ND

  • 711-2645-ND

    711-2645-ND

  • PSA-290-W-ND

    PSA-290-W-ND

  • CN12182_BERTHA1-TYPE3-M-ND

    CN12182_BERTHA1-TYPE3-M-ND

  • CN13923_MIRELLA-50-W-PF-VERO13-ND

    CN13923_MIRELLA-50-W-PF-VERO13-ND

  • 711-1171-ND

    711-1171-ND

  • 1621-1073-ND

    1621-1073-ND

  • 711-2579-ND

    711-2579-ND

  • 1621-1124-ND

    1621-1124-ND

Related Blogs

  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
  • 2026 / 08 / 04

    LG Display Invests 3 Trillion Won in OLED Technology

    LG Display secures 3 trillion won in total investment—1.5 trillion won in state-backed low-interest financing matched by corporate funds—to advance next-gen OLED technologies....

    LG Display Invests 3 Trillion Won in OLED Technology
  • 2026 / 08 / 03

    Nvidia Locks InP Capacity For $4 Billion

    NVIDIA commits $4B to lock InP capacity from Lumentum and Coherent amid severe shortages. Vital for AI datacenter optics, supply trails demand by 30%+...

    Nvidia Locks InP Capacity For $4 Billion
  • 2026 / 07 / 31

    Holtek Increase Product Prices 10% - 20%

    Holtek Semiconductor announces a sweeping 10%-20% price hike across its MCU portfolio, driven by relentless cost pressures from packaging and foundry partners....

    Holtek Increase Product Prices 10% - 20%
  • 2026 / 07 / 30

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan

    UMC commits $4.6B to silicon photonics expansion, fast-tracking Singapore P4 fab for immediate capacity while breaking ground on Tainan P7/P8....

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan
  • 2026 / 07 / 29

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices

    MLCC prices surge again: Samsung hikes 30%, Taiyo Yuden raises prices amid severe shortages. AI servers use 8-10x more MLCC, pushing lead times beyond 20 weeks. ...

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices
  • 2026 / 07 / 28

    Microchip Acquires Israeli Edge AI Chip Company Hailo

    Microchip buys Hailo to expand edge AI processing, integrating accelerators and vision SoCs. The acquisition closes in September 2026....

    Microchip Acquires Israeli Edge AI Chip Company Hailo
  • 2026 / 07 / 27

    Qualcomm Chip Prices, Up Double-Digit Percentage

    Qualcomm announces double-digit chip price hikes from September 1 as AI-driven supply shortages and surging DRAM costs bite. ...

    Qualcomm Chip Prices, Up Double-Digit Percentage
Contact Information
close