M29F400BB70N1

Introducing the M29F400BB70N1, an advanced memory product designed to meet the increasing storage needs of modern electronic devices. This high-performance Flash memory chip offers a capacity of 4 megabits, providing ample space for storing critical data and enhancing the overall performance of your devices. The M29F400BB70N1 is built with cutting-edge technology, ensuring fast write and erase cycles, so you can quickly and efficiently update and erase data when needed. Its advanced features include a 70 nanosecond max access time, allowing for rapid retrieval of information, and a supply voltage range of 2.7V to 3.6V, making it compatible with a wide range of systems. This memory product is designed to be highly reliable, with a high endurance rating and robust data retention capabilities. It also boasts a small form factor, making it ideal for integration into compact designs and space-constrained applications. Whether you are developing a new electronic device or upgrading an existing one, the M29F400BB70N1 Flash memory chip is the ideal choice. It offers superior performance, reliability, and flexibility, ensuring your device operates at its peak potential.

banner

Other Products

View More
  • 338-1364-ND

    338-1364-ND

  • 399-11532-ND

    399-11532-ND

  • 125565-01-ND

    125565-01-ND

  • 338-4088-ND

    338-4088-ND

  • 31762-103-ND

    31762-103-ND

  • 338-1914-ND

    338-1914-ND

  • 399-11535-ND

    399-11535-ND

  • 495-76628-ND

    495-76628-ND

  • 31762-40-ND

    31762-40-ND

  • 495-76897-ND

    495-76897-ND

  • 30434-49-ND

    30434-49-ND

  • 44603-RUBBERBOOT-ND

    44603-RUBBERBOOT-ND

Related Blogs

  • 2026 / 03 / 31

    Omron Divests Core Electronic Components Business

    Omron divests its founding Device & Module Solutions business to Carlyle for ¥81 billion. The electronic components unit will become independent via a two-phase transaction in 2026, allowing OMRON to focus on industrial automation....

    Omron Divests Core Electronic Components Business
  • 2026 / 03 / 30

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market

    Apple partners with YMTC to integrate China-made NAND flash into China-exclusive iPhones, cutting costs amid rising memory prices. ...

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market
  • 2026 / 03 / 27

    Micron Considers Acquisition of JDI's Mobara Plant

    Micron is in talks to acquire JDI's Mobara LCD plant in Japan for conversion into a semiconductor assembly and testing facility....

    Micron Considers Acquisition of JDI's Mobara Plant
  • 2026 / 03 / 26

    Tower Semiconductor Strategically Restructures Japan Operations

    Tower Semiconductor restructures Japan operations: acquires full ownership of 300mm Fab 7 while Nuvoton takes 200mm Fab 5 for $25M...

    Tower Semiconductor Strategically Restructures Japan Operations
  • 2026 / 03 / 25

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide

    A comprehensive guide to AMD/Xilinx FPGA evolution, spanning from classic CPLDs and early XC3000/4000 architectures through cost-optimized Spartan series to cutting-edge Zynq UltraScale+ MPSoCs......

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
  • 2026 / 03 / 24

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers

    The FCC has banned all foreign-manufactured consumer routers from entering the U.S. market without authorization, citing national security risks....

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
  • 2026 / 03 / 23

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products

    Discover Qorvo's industry-leading RF solutions and GaN power amplifiers. From 5G infrastructure to satellite communications, explore best-selling ICs including QPA2966, TGA2214-CP, and QPA1314......

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
  • 2026 / 03 / 20

    Three core components of power electronics: MOSFET, BJT, and IGBT

    A concise comparison of MOSFET, BJT, and IGBT— fundamental power semiconductor devices spanning voltage-controlled high-speed switching, current-controlled amplification, and hybrid high-voltage power solutions...

    Three core components of power electronics: MOSFET, BJT, and IGBT
  • 2026 / 03 / 19

    Middle East Conflict Triggers Risk of Surging Chip Material Costs

    Middle East conflict disrupts Qatar's helium supply, threatening semiconductor manufacturing costs. Chipmakers rely on helium for lithography, cooling, and leak detection—with no viable substitutes....

    Middle East Conflict Triggers Risk of Surging Chip Material Costs
  • 2026 / 03 / 18

    Break the Ice! NVIDIA Resumes H200 Production for China

    Nvidia resumes H200 chip production for China after securing U.S. export licenses. The restart follows December 2025 policy changes allowing sales with 25% revenue-sharing requirements....

    Break the Ice! NVIDIA Resumes H200 Production for China
Contact Information
close