ADSP-2185BSTZ-133

Introducing the ADSP-2185BSTZ-133, a breakthrough product in the field of digital signal processing (DSP). Designed to exceed expectations and meet the demands of modern-day applications, this high-performance single-chip DSP offers unrivaled speed, efficiency, and flexibility. At the heart of this advanced DSP is a powerful 16-bit fixed-point processor capable of executing instructions at a staggering clock speed of 133 MHz. This allows for swift and efficient processing of complex algorithms, making it ideal for applications such as telecommunications, audio and video processing, and industrial automation. Featuring a comprehensive set of peripherals and interfaces, the ADSP-2185BSTZ-133 provides seamless integration with various system components. With its built-in memory, including 16K words of on-chip program RAM and 32K words of on-chip data RAM, it offers ample storage capacity for efficient data manipulation. Additionally, the ADSP-2185BSTZ-133 supports multiple power-saving modes, ensuring optimal energy consumption. This, coupled with its small footprint and low power requirements, makes it an exceptional choice for battery-operated devices and portable applications. Overall, the ADSP-2185BSTZ-133 sets a new industry standard for digital signal processors. Its impressive performance, extensive memory, and power-efficient design make it the go-to solution for a wide range of applications, empowering developers to achieve their goals efficiently and effectively.

banner

Other Products

View More
  • Texas Instruments UCC2813PWTR-4G4

    Texas Instruments UCC2813PWTR-4G4

  • Power Integrations TOP245YN

    Power Integrations TOP245YN

  • NXP USA Inc. TEA1506T/N1,518

    NXP USA Inc. TEA1506T/N1,518

  • Power Integrations INN3672C-H606-TL

    Power Integrations INN3672C-H606-TL

  • Power Integrations LNK584GG-TL

    Power Integrations LNK584GG-TL

  • onsemi NCP1011ST130T3G

    onsemi NCP1011ST130T3G

  • Fairchild Semiconductor FSFR1800HSL

    Fairchild Semiconductor FSFR1800HSL

  • Power Integrations TOP209P

    Power Integrations TOP209P

  • onsemi FSCQ0965RTYDTU

    onsemi FSCQ0965RTYDTU

  • Power Integrations TOP248Y

    Power Integrations TOP248Y

  • Rohm Semiconductor BD7J101EFJ-LBE2

    Rohm Semiconductor BD7J101EFJ-LBE2

  • Fairchild Semiconductor FSFR1800US

    Fairchild Semiconductor FSFR1800US

Related Blogs

  • 2026 / 04 / 27

    CPU Prices Surge as Intel and AMD Continuous Price Increase of Up to 20%

    Intel and AMD have raised CPU prices by up to 20% since March 2026, with server chips seeing the steepest hikes. Lead times have stretched from 1–2 weeks to 8–12 weeks...

    CPU Prices Surge as Intel and AMD Continuous Price Increase of Up to 20%
  • 2026 / 04 / 24

    Betting on Plasmonic Photonics, Marvell Acquires Polariton Technologies

    Marvell bolsters its AI infrastructure portfolio by acquiring Swiss startup Polariton Technologies. ...

    Betting on Plasmonic Photonics, Marvell Acquires Polariton Technologies
  • 2026 / 04 / 23

    SpaceX & Cursor Strike Deal: $600B Acquisition Option or $100B Collaboration

    SpaceX has inked a deal with AI coding startup Cursor, securing an option to acquire the company for $60 billion or pay $10 billion to advance their collaboration. ...

    SpaceX & Cursor Strike Deal: $600B Acquisition Option or $100B Collaboration
  • 2026 / 04 / 22

    Japan Sudden earthquake, Disrupts Key Semiconductor Supply Chain​

    A 7.7-magnitude earthquake hit Japan's key semiconductor region. While memory chip production has largely resumed, extended shutdowns at major photoresist plants pose a risk in the coming weeks....

    Japan Sudden earthquake, Disrupts Key Semiconductor Supply Chain​
  • 2026 / 04 / 21

    MSP430 Selection Essentials: 16-Bit Ultra-Low-Power Mixed-Signal MCUs

    The MSP430 series is TI's 16-bit ultra-low-power mixed-signal MCU, featuring sub-μA standby consumption and 1μs wake-up. ...

    MSP430 Selection Essentials: 16-Bit Ultra-Low-Power Mixed-Signal MCUs
  • 2026 / 04 / 20

    SK Hynix Begins Mass Production of 192GB SOCAMM2

    SK Hynix begins mass-producing 192GB SOCAMM2 modules using 1c LPDDR5X for NVIDIA's Vera Rubin platform, doubling bandwidth while cutting power by 75%....

    SK Hynix Begins Mass Production of 192GB SOCAMM2
  • 2026 / 04 / 17

    ASML Capacity Plan: Doubling EUV Lithography Output by 2027

    ASML plans to double EUV lithography capacity by 2027, targeting 80 Low-NA systems annually, up from 44 in 2025....

    ASML Capacity Plan: Doubling EUV Lithography Output by 2027
  • 2026 / 04 / 16

    Kyocera's Strategic Acquisition of Ushio's Semiconductor Laser Business

    Kyocera acquires Ushio's semiconductor laser business for ~¥1B, completing its RGB laser diode portfolio. The deal strengthens GaAs-based red laser capabilities to complement existing GaN blue/green tech...

    Kyocera's Strategic Acquisition of Ushio's Semiconductor Laser Business
  • 2026 / 04 / 15

    Russia Imposes Helium Export Controls

    Russia imposed temporary helium export controls through end-2027, requiring special permits for shipments outside the EEU. ...

    Russia Imposes Helium Export Controls
  • 2026 / 04 / 14

    Japanese Government Approves Additional ¥631.5 Billion Subsidy for Rapidus

    Japanese government approved ¥631.5B additional subsidy for Rapidus. Funds target 2nm AI chip production for Fujitsu, with mass production planned for H2 FY2027....

    Japanese Government Approves Additional ¥631.5 Billion Subsidy for Rapidus
Contact Information
close