IR2106STRPBF

The IR2106STRPBF is a high voltage, high-speed power MOSFET and IGBT driver. It is designed to control both the high-side and low-side switch of a half-bridge configuration. This driver IC is ideal for applications such as motor drive circuits, switch mode power supplies, and uninterruptible power supplies. Featuring a floating channel, the IR2106STRPBF provides optimum flexibility to drive both lower and upper MOSFETs or IGBTs. This allows for easy implementation of a high-frequency PWM circuit. With its low delay time and low propagation delay variation, this driver IC ensures precise control and efficient switching performance. It also offers various protection features such as under-voltage lockout, short circuit protection, and thermal shutdown. The IR2106STRPBF is offered in an 8-pin SOIC package, making it compact and easy to use in a wide range of applications. It has a wide supply voltage range of 10V to 20V, allowing for compatibility with various power supply units. With its high reliability, exceptional performance, and comprehensive protection features, the IR2106STRPBF is the perfect choice for demanding power control applications.

banner

Other Products

View More
  • 3465-WW-EWS3-3-ND

    3465-WW-EWS3-3-ND

  • LZP-D0UA00-00U5-ND

    LZP-D0UA00-00U5-ND

  • 1125-1505-ND

    1125-1505-ND

  • 475-SFH4235-ZTR-ND,475-SFH4235-ZCT-ND,475-SFH4235-ZDKR-ND

    475-SFH4235-ZTR-ND,475-SFH4235-ZCT-ND,475-SFH4235-ZDKR-ND

  • 365-1588-ND

    365-1588-ND

  • OP291B-ND

    OP291B-ND

  • 365-1147-2-ND,365-1147-1-ND,365-1147-6-ND

    365-1147-2-ND,365-1147-1-ND,365-1147-6-ND

  • 2460-L933-SP275-2-30TR-ND

    2460-L933-SP275-2-30TR-ND

  • ASDL-4263-C22-ND

    ASDL-4263-C22-ND

  • LTE-3279K-ND

    LTE-3279K-ND

  • 1830-INL-5AIR45-ND

    1830-INL-5AIR45-ND

  • 751-1217-2-ND,751-1217-1-ND,751-1217-6-ND

    751-1217-2-ND,751-1217-1-ND,751-1217-6-ND

Related Blogs

  • 2026 / 03 / 30

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market

    Apple partners with YMTC to integrate China-made NAND flash into China-exclusive iPhones, cutting costs amid rising memory prices. ...

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market
  • 2026 / 03 / 27

    Micron Considers Acquisition of JDI's Mobara Plant

    Micron is in talks to acquire JDI's Mobara LCD plant in Japan for conversion into a semiconductor assembly and testing facility....

    Micron Considers Acquisition of JDI's Mobara Plant
  • 2026 / 03 / 26

    Tower Semiconductor Strategically Restructures Japan Operations

    Tower Semiconductor restructures Japan operations: acquires full ownership of 300mm Fab 7 while Nuvoton takes 200mm Fab 5 for $25M...

    Tower Semiconductor Strategically Restructures Japan Operations
  • 2026 / 03 / 25

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide

    A comprehensive guide to AMD/Xilinx FPGA evolution, spanning from classic CPLDs and early XC3000/4000 architectures through cost-optimized Spartan series to cutting-edge Zynq UltraScale+ MPSoCs......

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
  • 2026 / 03 / 24

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers

    The FCC has banned all foreign-manufactured consumer routers from entering the U.S. market without authorization, citing national security risks....

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
  • 2026 / 03 / 23

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products

    Discover Qorvo's industry-leading RF solutions and GaN power amplifiers. From 5G infrastructure to satellite communications, explore best-selling ICs including QPA2966, TGA2214-CP, and QPA1314......

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
  • 2026 / 03 / 20

    Three core components of power electronics: MOSFET, BJT, and IGBT

    A concise comparison of MOSFET, BJT, and IGBT— fundamental power semiconductor devices spanning voltage-controlled high-speed switching, current-controlled amplification, and hybrid high-voltage power solutions...

    Three core components of power electronics: MOSFET, BJT, and IGBT
  • 2026 / 03 / 19

    Middle East Conflict Triggers Risk of Surging Chip Material Costs

    Middle East conflict disrupts Qatar's helium supply, threatening semiconductor manufacturing costs. Chipmakers rely on helium for lithography, cooling, and leak detection—with no viable substitutes....

    Middle East Conflict Triggers Risk of Surging Chip Material Costs
  • 2026 / 03 / 18

    Break the Ice! NVIDIA Resumes H200 Production for China

    Nvidia resumes H200 chip production for China after securing U.S. export licenses. The restart follows December 2025 policy changes allowing sales with 25% revenue-sharing requirements....

    Break the Ice! NVIDIA Resumes H200 Production for China
  • 2026 / 03 / 17

    Sony CIS Yield Crisis: Supply Chain Concerns for Apple

    Sony faces yield challenges at its Nagasaki CIS plant, risking supply disruptions to Apple which accounts for 55% of its smartphone sensor revenue....

    Sony CIS Yield Crisis: Supply Chain Concerns for Apple
Contact Information
close